Chip packages with terminal pads of different form factors
A chip packaging and terminal technology, which is applied in the fields of electric solid state devices, semiconductor devices, semiconductor/solid state device components, etc., and can solve the problem of time-consuming testing.
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[0062] Aspects and embodiments are described below with reference to the drawings, wherein like reference numerals are generally used to refer to like elements throughout. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more aspects of the embodiments. It will be apparent, however, to one skilled in the art that one or more aspects of these embodiments may be practiced with a lesser degree of specific detail. In other instances, well-known structures and elements are shown in schematic form in order to facilitate describing one or more aspects of the embodiments. Accordingly, the following description does not have a limiting sense, and the scope is defined by the appended claims. It should also be noted that the representations of various layers, sheets, chips or substrates in the figures are not necessarily to scale.
[0063] In the following description, reference is ...
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