A method of manufacturing a wound film capacitor

Abstract

The invention relates to a manufacturing method of a winding type film capacitor, which includes the following steps, the winding step: winding the capacitor raw material into a circular capacitor core with a winding core in the middle; the pre-punching step: winding the The circumferential surface of the circular capacitor core formed in the process extrudes two mutually parallel end faces, so that the circular capacitor core is pre-pressed into a flat capacitor core that is not easy to roll; stamping process: the The two parallel end surfaces of the flat capacitor core formed in the pre-stamping process apply pressure, so that the distance between the two parallel end surfaces is shortened. The beneficial effect of the present invention is: by performing pre-stamping before the stamping process, the central state of the capacitor original is very random during the stamping process in the prior art, so that the center of the stamped wound capacitor will have cracks. Technical problem .

Description

technical field [0001] The invention relates to a manufacturing method of a winding capacitor, in particular to a manufacturing method of a winding film capacitor. Background technique [0002] In the prior art, when manufacturing film capacitors, the first step: element winding process; the second step: forming stamping process and other processes are carried out separately. In this case, since the circular capacitor core produced in the element winding process needs to be rearranged in the forming stamping process, while the core portion of the circular capacitor core (such as figure 1 As shown, the winding core is S-shaped in the center of the circular capacitor core. In the prior art, each capacitor core is circular, and it is difficult to make the winding core be placed on the stamping device at the same angle) to Different angles are placed on the stamping device (as follows figure 1 ), it takes a lot of time to arrange the circular capacitor core, and the central st...

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Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a manufacturing method of wound-type film capacitors, which solves the problem that in the prior art, the central state of the capacitor original is very random during stamping and forming, so that cracks will appear in the center of the stamped and formed winding-type capacitors technical issues

[0005] The beneficial effect of the present invention is: by performing pre-stamping before the stamping process, the central state of the capacitor original is very random during stamping in the prior art, so that the center of the stamped winding capacitor will have cracks. Technical problem

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