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Cutting device

A cutting device and cutting fluid technology, applied in the direction of fine work devices, work accessories, stone processing equipment, etc., can solve the problems of adhering to the surface of the processed object after processing, and the atmospheric gas is not smoothly discharged, etc., To achieve the effect of smooth exhaust and enhanced flow

Active Publication Date: 2014-08-20
DISCO CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In the conventional cutting device in which the exhaust port is arranged on the side wall of the processing chamber, since the atmospheric gas in the processing chamber is not exhausted smoothly, cutting chips contained in the atmospheric gas may adhere to the workpiece after processing. on the surface

Method used

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Embodiment Construction

[0040] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. refer to figure 1 , shows a perspective view of the cutting device 2 according to the embodiment of the present invention. Reference numeral 4 denotes a base of the cutting device 2 , and a processing chamber 6 is mounted on the base 4 .

[0041] The processing chamber 6 is formed of a transparent resin such as figure 2 As shown, the machining chamber 6 has an end wall 6 a on the side opposite to the machining feed direction indicated by arrow X1 , an end wall 6 b on the machining feed direction side, and a ceiling 6 c. A chuck table 14 is arranged on the base 4 in the processing chamber 6 , and the chuck table 14 is rotatable and reciprocating in the X-axis direction by a processing feeding mechanism not shown.

[0042] A water shield 16 is arranged around the chuck table 14, and a bellows 18 is connected to the water shield 16 and the base 4, and the bello...

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PUM

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Abstract

The invention provides a cutting device with a structure capable of smoothly exhausting air in a processing chamber. The cutting device comprises a chuck worktable for holding a processed object and a processing member for cutting the processed object with a cutting blade installed on the tail end of a main shaft while supplying cutting liquid to the processed object held on the chuck worktable, and is characterized by comprising a processing chamber. The processing chamber surrounds the chuck worktable and the processing member and accommodates a processing area where the processing member cuts the processed object held on the chuck worktable. The processing chamber comprises an exhaust port that exhausts air in the processing chamber to an exhaust suction source, and an intake that supplies air outside the processing chamber to the processing chamber. The exhaust port is at a downward opening in the high-speed flying direction of the cutting liquid containing the cutting bits because of the high-speed rotation of the cutting blade. The end portion wall opening of the processing chamber is formed on a side, opposite to the exhaust port relative to the cutting blade of the intake.

Description

technical field [0001] The present invention relates to a cutting device for cutting a workpiece such as a wafer. Background technique [0002] Processed objects such as semiconductor wafers, resin substrates, various ceramic substrates, and glass substrates on which many devices such as ICs and LSIs are formed on the surface are divided into individual chips by a cutting device called a cutting device. The resulting chips are widely used in various electrical equipment. [0003] The cutting device supplies cutting fluid such as pure water to the high-speed rotating cutting blade and the workpiece from multiple nozzles, while cooling the processing heat and discharging chips from the surface of the workpiece to perform cutting. The surface of the workpiece is cleaned (for example, refer to JP-A-2011-114220 and JP-A-2001-007058). [0004] Generally, in a cutting device, in order to prevent the cutting fluid from scattering into the device, a processing chamber is formed sur...

Claims

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Application Information

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IPC IPC(8): B28D5/00B28D7/02
Inventor 秋田壮一郎高桥聪成田亮治寺师健太郎上妻沙纪名嘉真惇清川聪冈田圭介石内伸雄
Owner DISCO CORP