The structure of the chip carrier
A carrier plate and chip technology, which is applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of high cost of double-sided chip carrier, poor process stability of double-sided chip carrier, and poor stacking of chip carrier. And other issues
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[0059] In order to make the structural features of the present invention and the achieved effects have a further understanding and recognition, preferred embodiments and detailed descriptions are specially used, which are described as follows:
[0060] The present invention solves the problems related to the structure of the chip carrier in the prior art. In the process of bonding the chip to the substrate, the chip placed in the chip carrier sometimes needs to be turned over and placed upside down in the chip carrier. Flipping the chips one by one manually has a high error rate and is time-consuming, while using a double-sided chip carrier to place the chips costs a lot, and the stability of the manufacturing process of the double-sided chip carrier is poor. In addition, the conventional chip carrier The mechanism for preventing wrong stacking direction of the disc is insufficient, and the conventional chip carrier cannot fix the protective paper on the chip carrier. In order ...
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