Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Image sensor glass cavity wall manufacturing method

A technology of image sensor and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve the problems of high manufacturing cost and low yield rate, and achieve the effect of avoiding photoresist forming and bonding process

Inactive Publication Date: 2014-08-20
NAT CENT FOR ADVANCED PACKAGING
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to overcome the deficiencies in the prior art, and provide a method for manufacturing the glass cavity wall of an image sensor, which can avoid the traditional method using photoresist forming and bonding process, expensive manufacturing cost and low yield.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Image sensor glass cavity wall manufacturing method
  • Image sensor glass cavity wall manufacturing method
  • Image sensor glass cavity wall manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Embodiment 1: A method for manufacturing an image sensor glass chamber wall, comprising the following steps:

[0025] (1) Make an ultra-thin square glass tube, such as figure 1 As shown, the wall thickness of the square glass tube is 50 μm, and the cross-sectional size of the square glass tube matches the size of the pattern on the image sensor wafer;

[0026] (2) Cut the glass tube into a single square piece with a diamond wire, a diamond blade or a laser, and the thickness of the square piece is 50 μm;

[0027] (3) if figure 2 As shown, one surface of several square sheets 2 is dipped in adhesive 4, and pressed onto the glass substrate 1 to form several square cavities corresponding to the patterns on the image sensor wafer one by one. The thickness is 100 μm; the curing process is carried out after pressing, the temperature of the curing process is 50 ° C, and the time is 30 min;

[0028] (4) if image 3 As shown, the adhesive 3 is coated on the other surface of...

Embodiment 2

[0030] Embodiment 2: A method for manufacturing an image sensor glass chamber wall, comprising the following steps:

[0031] (1) Make an ultra-thin square glass tube, such as figure 1 As shown, the wall thickness of the square glass tube is 300 μm, and the cross-sectional size of the square glass tube matches the size of the pattern on the image sensor wafer;

[0032] (2) Cut the glass tube into a single square piece with a diamond wire, a diamond blade or a laser, and the thickness of the square piece is 200 μm;

[0033] (3) if figure 2 As shown, one surface of several square sheets 2 is coated with adhesive 4, and pressed onto the glass substrate 1 to form several square cavities corresponding to the patterns on the image sensor wafer one by one, and the glass substrate The thickness is 500μm; the curing process is carried out after pressing, the temperature of the curing process is 150 ° C, and the time is 10 min;

[0034] (4) if image 3 As shown, the adhesive 3 is co...

Embodiment 3

[0036] Embodiment 3: A method for manufacturing an image sensor glass chamber wall, comprising the following steps:

[0037] (1) Make an ultra-thin square glass tube, such as figure 1 As shown, the wall thickness of the square glass tube is 100 μm, and the cross-sectional size of the square glass tube matches the size of the pattern on the image sensor wafer;

[0038] (2) Cut the glass tube into a single square piece with a diamond wire, a diamond blade or a laser, and the thickness of the square piece is 100 μm;

[0039] (3) if figure 2 As shown, the adhesive 4 is coated on the surface of the glass substrate, and the position of the adhesive coating area corresponds to the pressing area of ​​the square sheet on the glass substrate, and the shape and size of the adhesive coating area are similar to those of the square sheet. The shape and size of the glass substrate are consistent; then the square sheet is pressed onto the glass substrate 1 to form a number of square caviti...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to an image sensor glass cavity wall manufacturing method. The method is characterized by comprising the steps that (1) an ultra-thin square glass tube is manufactured, wherein the wall thickness of the square glass tube ranges from 50 microns to 300 microns, and the section size of the square glass tube is matched with the size of patterns on an image sensor wafer; (2) the glass tube is cut into a plurality of square pieces, wherein the thickness of each square piece ranges from 50 microns to 200 microns; (3) one surfaces of the square pieces are pressed and bound to a glass substrate through a binder, and a plurality of square cavities corresponding to the patterns on the image sensor wafer in a one-to-one mode are formed; (4) the other surfaces of the square pieces are coated with the binder; the face, bound with the square pieces, of the glass substrate is in bonding with the face, with the patterns, of the image sensor wafer, and therefore a glass cavity wall is formed on an image sensor. The problems that in a traditional method, the photoresist forming bonding technology is adopted, the manufacturing cost is high, and the yield is low are solved.

Description

technical field [0001] The invention relates to a method for manufacturing a glass chamber wall of an image sensor, and belongs to the technical field of microelectronic packaging. Background technique [0002] In the wafer-level packaging process of image sensors, the particle contamination of image sensors can make the module invalid. For high-resolution devices, the loss in yield increases with smaller pixel sizes. For example, in a 3-megapixel sensor, where the pixel size is less than 2 microns, if a particle occludes more than one pixel, the image sensor fails. To limit the number of particles of this size, strict particle control measures are required during the module assembly process to avoid yield loss. But these particle control measures will increase the cost of production. [0003] Using a layer of glass to protect the working area of ​​the sensor from contamination prior to wafer dicing and device mounting can improve yield. Since particles mounted on top of...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/78
CPCH01L27/14683
Inventor 姜峰张文奇顾海洋
Owner NAT CENT FOR ADVANCED PACKAGING
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com