Wafer suction device and method for parallel device
A wafer and equipment technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of not being able to let go of the wafer, and achieve the effects of easy operation, reducing fragmentation rate, and improving equipment utilization.
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[0019] The present invention will be further described below with reference to the drawings and specific embodiments, but it is not a limitation of the present invention.
[0020] Such as figure 2 As shown, the present invention provides a wafer adsorption device for parallel equipment, including: factory vacuum pipe 4, equipment vacuum pipe 7, vacuum channel 6, and suction cup 5. The suction cup 5 is arranged at one end of the vacuum channel 6, and the factory vacuum pipe 4. The equipment vacuum pipeline 7 is connected with the vacuum channel 6, and the pipeline diameter of the equipment vacuum pipeline 7 is greater than or equal to the pipeline diameter of the factory vacuum pipeline 4.
[0021] In this embodiment, the diameter of the vacuum pipeline of the equipment is changed, and the purpose of controlling the suction and release of the wafer by the sucker is adopted.
[0022] In a preferred embodiment, it further includes: a first vacuum valve 3, which is arranged on the fact...
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