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Load lock device and vacuum treatment chamber equipped with same

A locking device and a technology for processing objects, which are applied in the field of loading locking devices and vacuum processing devices, can solve the problems of the decline in the pass rate of the processing object and the inability to fully suppress the adhesion of foreign matter, and achieve the effect of suppressing the decline in the pass rate and suppressing adhesion

Inactive Publication Date: 2014-09-03
SHARP KK +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that the adhesion of foreign matter on the object to be processed cannot be sufficiently suppressed, and as a result, the yield of the object to be processed decreases.

Method used

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  • Load lock device and vacuum treatment chamber equipped with same
  • Load lock device and vacuum treatment chamber equipped with same
  • Load lock device and vacuum treatment chamber equipped with same

Examples

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Embodiment Construction

[0031] Hereinafter, embodiments of the present invention will be described in detail based on the drawings. In addition, this invention is not limited to the following embodiment.

[0032] figure 1 is a diagram showing the overall configuration of a vacuum processing apparatus according to an embodiment of the present invention, figure 2 It is a figure which shows the load lock apparatus in the vacuum processing apparatus which concerns on embodiment of this invention.

[0033] Such as figure 1 As shown, the vacuum processing apparatus 1 of the present embodiment includes a vacuum processing chamber 2 , a load lock device 3 , and an atmospheric transfer chamber 24 .

[0034] The vacuum processing chamber 2 is used, for example, to perform predetermined processing (for example, sputtering, etching, plasma CVD, etc.) in a vacuum atmosphere on an object S to be processed such as a glass substrate for a liquid crystal display device.

[0035] The atmospheric transport chamb...

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Abstract

A load lock device (1) comprises a load lock chamber (4), inside of which can be exhausted by vacuum to store a processing target object (S); a support platform (13), which is set inside the load lock chamber (4) to support the processing target object (S); and slow ventilation units (15), which is set in the load lock chamber (4) for supplying ventilation gas to the load lock chamber (4) in vacuum state, so as to switch the inside state of the load lock chamber (4) to atmospheric state. The slow ventilation units (15) are set symmetrically in left and right side relative to the support platform (13).

Description

technical field [0001] The present invention relates to a load lock device capable of suppressing adhesion of foreign matter (particles) to a processing target object in a load lock chamber, and to a vacuum processing device equipped with the same. Background technique [0002] For example, in the manufacturing process of glass substrates for liquid crystal display devices and the manufacturing process of semiconductor wafers, vacuum treatments such as sputtering, etching, and plasma CVD are performed. [0003] In addition, in a vacuum processing apparatus that performs such vacuum processing, when the object to be processed such as a glass substrate is brought into or carried out of the processing chamber for vacuum processing, once the inside of the vacuum processing chamber is returned to atmospheric pressure, gas adsorption will occur. Phenomena such as the inner wall of the vacuum processing chamber. Therefore, there is a problem that it takes a very long time to bring...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677C23C14/00C23C14/56C23C16/44
CPCH01L21/67201H01L21/67017C23C16/54
Inventor 西村直树佐藤重光大空弘树金子俊则
Owner SHARP KK