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Polishing pad and glass substrate manufacturing method using said polishing pad

A technology for a glass substrate and a manufacturing method, applied in the field of polishing pads, can solve the problems of decreased processing rate in the mirror polishing process, insufficient cleaning of the bottom, and inability to polish the glass substrate.

Active Publication Date: 2014-09-10
HOYA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, even when the cleaning process of the polishing pad is provided, there is a possibility that the bottoms of the opening pits provided on the surface of the polishing pad are not sufficiently cleaned.
As a result, there is a problem that components of the polishing liquid accumulate in the open pits to form aggregates, and the aggregates are sometimes released from the open pits during the mirror polishing process and adhere to the glass substrate.
[0009] On the other hand, in the case of reducing the amount of the polishing liquid component (in the case of reducing the content of the polishing liquid component in the polishing liquid), there is a possibility that the glass substrate cannot be polished sufficiently under the optimum conditions.
In addition, even if it is easy to clean and remove the polishing liquid components accumulated at the bottom of the open pit by forming the open pit large, there is a problem that the processing rate of the mirror polishing process decreases.

Method used

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  • Polishing pad and glass substrate manufacturing method using said polishing pad
  • Polishing pad and glass substrate manufacturing method using said polishing pad
  • Polishing pad and glass substrate manufacturing method using said polishing pad

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0079] For polishing flat plates (outer diameter approx. Inner diameter approx. A suede pad (manufactured by Filwel, NP225) was pasted on a doughnut-shaped donut shape, and a dummy workpiece was processed for 10 hours. In the processing of the dummy workpiece, the load value was decreased from 12 kPa to 5 kPa over time. The rotation speed of the carrier relative to the polishing plate was about 2 rpm, and the revolution speed of the carrier relative to the flat plate was about 10 rpm.

[0080] After the processing of the dummy workpiece is completed, the polishing pad is peeled off from the double-sided polishing machine, and the polishing pads at the positions corresponding to the radius of 240mm, 400mm, and 540mm of the polishing plate are respectively intercepted, and the confocal microscope (Keyence ( A laser microscope, VK-9700 manufactured by KEYENCE) was used for three-dimensional measurement of a 300 μm square. Figure 8 The above intercept positions are shown in ...

Embodiment 2

[0099] Except having set the processing time of a dummy workpiece into 5 hours, the buff pad was produced by the method similar to Example 1, and the glass substrate was produced using the produced buff pad.

Embodiment 3

[0101] The arrangement of the dummy workpiece was changed, and the center part of the flat plate was set as the target of dummy workpiece processing, and the polishing pad was produced by the method similar to Example 2, and the glass substrate was produced using the produced polishing pad.

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Abstract

A polishing pad used in a glass substrate mirror-polishing process, characterized in that: the polishing pad has multiple open holes on the main surface that contacts the glass substrate; one open hole and another open hole adjacent thereto are separated by a partition; and of the side surfaces of said partition, an inclined section is provided on the side surface on the side of the other open hole and the inclined section has a minimum radius of curvature 20 - 100 [mu]m. Said polishing pad provides, for example, a polishing pad with which polishing liquid components do not accumulate easily in the open holes while the mirror-finish processing rate is maintained.

Description

technical field [0001] The invention relates to a polishing pad and a method for manufacturing a glass substrate using the polishing pad. More specifically, it relates to a polishing pad used in a mirror polishing process of a glass substrate provided on a polishing plate, and a method of manufacturing a glass substrate using the polishing pad, which has a Open pits, and the polishing liquid components are difficult to accumulate in the open pits. Background technique [0002] In recent years, as the performance of disk devices (for example, hard disk drives HDD) mounted with information recording media has increased, the quality level required for the media used has become higher. In particular, when there are deposits on the surface of the glass substrate for media, the head may come into contact with the deposits, causing a major obstacle to recording characteristics. Therefore, it is desirable that there is little attachment on the substrate. [0003] Here, as a proce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/26B24B1/00B24B7/24B24B37/00
CPCB24B37/26
Inventor 小松隆史
Owner HOYA CORP
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