Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Optical communication device

An optical communication and mounting surface technology, applied in the field of optical communication, can solve the problems of large size of the optical coupling shell, unfavorable miniaturization, increase the size of the optical communication device, etc., and achieve the effect of reducing the size and being conducive to miniaturization

Inactive Publication Date: 2014-09-17
SCIENBIZIP CONSULTINGSHENZHENCO
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the two optical coupling shells cover the light-emitting element and the light-receiving element, the planar optical waveguide usually needs to be thicker or a cushion layer is provided between the planar optical waveguide and the circuit board, such as the planar optical waveguide to be compatible with the two optical The coupling shell is used for optical coupling, which increases the volume of the optical communication device
In addition, the volume of the optical coupling housing is usually large, which also increases the volume of the optical communication device, which is not conducive to miniaturization

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Optical communication device
  • Optical communication device
  • Optical communication device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] Such as figure 1 As shown, an optical communication device 100 provided for an embodiment of the present invention includes a circuit board 10, a processor 20, a first controller 30, a light emitting element 40, a light receiving element 50, a second control device 60, a memory 70 and a planar optical waveguide 80.

[0013] The circuit board 10 includes a mounting surface 101 and a lower surface 102 opposite to the mounting surface 101 . The installation surface 101 defines a groove 103 and a plurality of first through holes 104 and second through holes 105 penetrating through the installation surface 101 and the lower surface 102 . The groove 103 includes a bottom surface 1031 parallel to the installation surface 101 , a first slope 1032 inclined relative to the bottom surface 1031 , and a second slope 1033 inclined relative to the bottom surface 1031 . Both the first slope 1032 and the second slope 1033 are connected between the installation surface 101 and the bott...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An optical communication device comprises a circuit board, a light-emitting component, a light-receiving component and a planar light wave circuit. The circuit board comprises an installation surface. The installation surface is provided with a groove. The groove comprises a bottom surface, a connection installation surface as well a first inclined surface and a second inclined surface of the bottom surface. The first inclined surface and the second inclined surface are respectively provided with a reflecting layer. The light-emitting component comprises a light-emitting surface. A first light concentration portion is formed on the light-emitting surface. The light-emitting component is arranged on the installation surface and the first light concentration portion faces to the reflecting layer of the first inclined surface. The light-receiving component comprises a light-receiving surface. A second light concentration portion is formed on the light-receiving surface. The light-receiving component is arranged on the installation surface and the second light concentration portion faces to the reflecting layer of the second inclined surface. The planar light wave circuit is formed on the bottom surface, and the two ends of which are opposite to the reflecting layers of the first inclined surface and the reflecting layer of the second inclined surface respectively. The planar light wave circuit is formed on the bottom surface of the groove, so that the size of the optical communication device can be substantially reduced.

Description

technical field [0001] The present invention relates to the field of optical communication, in particular to an optical communication device. Background technique [0002] Existing optical communication devices generally include a circuit board, a light emitting element, a light receiving element, a planar light wave circuit (PLC) and two optical coupling housings. The light-emitting element and the light-receiving element are arranged on the circuit board at intervals. The planar optical waveguide is formed on the circuit board and arranged between the light-emitting element and the light-receiving element. Two optical coupling shells cover the light-emitting element and the light-receiving element respectively, one of which is coupled with one end of the light-emitting element and the planar optical waveguide, and the other optical coupling shell is coupled with the other end of the light-receiving element and the planar optical waveguide coupling. However, since the tw...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G02B6/42H04B10/40
Inventor 曾国峰
Owner SCIENBIZIP CONSULTINGSHENZHENCO
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com