[0012] Such as figure 1 As shown, an optical communication device 100 provided by an embodiment of the present invention includes a circuit board 10, a processor 20, a first controller 30, a light-emitting element 40, a light-receiving element 50, and a second controller. The device 60, a memory 70 and a planar optical waveguide 80.
[0013] The circuit board 10 includes a mounting surface 101 and a lower surface 102 opposite to the mounting surface 101. The mounting surface 101 is provided with a groove 103 and a plurality of first through holes 104 and second through holes 105 passing through the mounting surface 101 and the lower surface 102. The groove 103 includes a bottom surface 1031 parallel to the mounting surface 101, a first inclined surface 1032 inclined relative to the bottom surface 1031, and a second inclined surface 1033 inclined relative to the bottom surface 1031. The first inclined surface 1032 and the second inclined surface 1033 are both connected between the mounting surface 101 and the bottom surface 1031 and both form an angle of 45 degrees with the mounting surface 101. The first inclined surface 1032 and the second inclined surface 1033 are both plated with a reflective layer 1034, and the reflective layer 1034 may be gold or tweezers. The first through holes 104 and the second through holes 105 are distributed on both sides of the groove 103 and both contain conductive materials electrically connected to the internal circuits of the circuit board 10.
[0014] The mounting surface 101 is also provided with a first solder pad 1041 electrically connected to the conductive material in the first through hole 104, and a first solder pad 1041 electrically connected to the conductive material in the second through hole 105. Two solder pads 1051, two third solder pads 106 located between the first solder pad 1041 and the first slope 1032, and two solder pads 106 between the second solder pad 1051 and the second slope 1033 The fourth bonding pad 107. The two third solder pads 106 are spaced apart from each other, one of which is closer to the first inclined surface 1032 and the other is farther away from the first inclined surface 1032. The two fourth solder pads 107 are spaced apart from each other, one of which is closer to the second inclined surface 1033 and the other is farther away from the second inclined surface 1033.
[0015] Such as figure 2 As shown, the planar optical waveguide 80 is disposed on the bottom surface 1031. The planar optical waveguide 80 forms an angle of 45 degrees with the first inclined surface 1032 and the second inclined surface 1033, and both ends of the planar optical waveguide 80 are connected to the first inclined surface 1032 and the second inclined surface respectively. The reflective layer 1034 of 1033 is opposite. The planar optical waveguide 80 is provided with a fifth bonding pad 108 close to the first inclined surface 1032 and a sixth bonding pad 109 close to the second inclined surface 1033.
[0016] The light-emitting element 40 includes a light-emitting surface 401, and a hemispherical first light-concentrating portion 402 is formed on the light-emitting surface 401. The first condensing part 402 is formed by dropping colloid on the light-emitting surface 401. In other embodiments, the first condensing portion 402 may also be obtained by molding and manufacturing, and then bonded to the light-emitting surface 401. The light emitting element 40 is a laser diode (LD). The light-receiving element 50 includes a light-receiving surface 501, and a hemispherical second light-collecting portion 502 is formed on the light-receiving surface 501. The second condensing part 502 is formed by dropping colloid on the light receiving surface 501. In other embodiments, the second light-concentrating part 502 may also be obtained by molding and manufacturing, and then bonded to the light-receiving surface 501. The light receiving element 50 is a photo diode (PD).
[0017] See figure 2 and image 3 , The light-emitting element 40 is electrically connected to a third bonding pad 106 and the fifth bonding pad 108 close to the first inclined surface 1032 through a flip chip, wherein the light-emitting surface 401 faces the The first inclined surface 1032, the first light collecting portion 402 is opposite to the reflective layer 1034 on the first inclined surface 1032, and the central axis of the first light collecting portion 402 forms an angle of 45 degrees with the first inclined surface 1032. The light receiving element 50 is also electrically connected to a fourth solder pad 107 and the sixth solder pad 109 close to the second inclined surface 1033 by flip chip, wherein the light receiving surface 501 faces the second inclined surface 1033. The second condensing portion 502 is opposite to the reflective layer 1034 on the second inclined surface 1033, and the central axis of the second condensing portion 502 forms an angle of 45 degrees with the second inclined surface 1033.
[0018] The processor 20 is electrically connected to a third solder pad 106 far away from the first inclined surface 1032 and the first solder pad 1041 through a flip-chip method. The first controller 30 is electrically connected to the two third bonding pads 106 through flip-chip. In this way, the light-emitting element 40 is electrically connected to the circuit board 10 via the first controller 30, the processor 20, and the first through hole 104 in sequence.
[0019] The memory body 70 is electrically connected to a fourth solder pad 108 and the second solder pad 1051 away from the second inclined surface 1033 by flip chip. The second controller 60 is electrically connected to the two fourth bonding pads 108 by flip chip. In this way, the light receiving element 50 is electrically connected to the circuit board 10 via the second controller 60, the memory 70, and the second through hole 105 in sequence.
[0020] When in use, the processor 20 sends an excitation signal to the first controller 30. After receiving the excitation signal, the first controller 30 generates a corresponding drive signal and controls the light emitting element 40 from the light emitting surface 401 Emit light. The light emitted by the light-emitting element 40 is condensed by the first light-concentrating part 402 and then directed toward the reflective layer 1034 of the first inclined surface 1032, and then enters the planar optical waveguide 80, and is transmitted by the planar optical waveguide 80. After being transmitted, it is projected to the reflective layer 1034 of the second inclined surface 1033, and then reflected to the second light-concentrating part 502, and finally the second light-concentrating part 502 converges and projects the light-receiving surface 501, and the light-receiving The element 50 converts the optical signal into an electrical signal and sends it to the second controller 60 for amplifying processing, for example, and the memory 70 stores the electrical signal processed by the second controller 60.
[0021] In other embodiments, the fifth solder pad 108 and the sixth solder pad 109 may also be provided on the mounting surface 101, that is, not on the planar optical waveguide 80.
[0022] Compared with the prior art, since the planar light guide 80 is formed on the bottom surface 1031 of the groove 103, instead of forming the planar light guide 80 on the mounting surface 101, in addition, the first light collecting portion 402 and The second condensing portion 502 is formed on the light-emitting surface 401 and the light-receiving surface 501, instead of providing an optical coupling housing covering the light-emitting element and the light-receiving element, respectively. Therefore, the light-emitting element of the present invention The communication device 100 can be greatly reduced in size, which is beneficial to miniaturization.
[0023] It is understandable that for those of ordinary skill in the art, various other corresponding changes and modifications can be made according to the technical concept of the present invention, and all these changes and modifications should fall within the protection scope of the claims of the present invention.
