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Pressure-controlled wafer carrier and wafer transport system

A wafer carrying and wafer technology, applied in the direction of conveyor objects, transportation and packaging, semiconductor/solid-state device manufacturing, etc., can solve the problem of polluting wafers

Active Publication Date: 2014-09-17
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This can lead to issues such as allowing moisture and / or chemicals to enter the FOUP, which can contaminate the wafer

Method used

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  • Pressure-controlled wafer carrier and wafer transport system
  • Pressure-controlled wafer carrier and wafer transport system
  • Pressure-controlled wafer carrier and wafer transport system

Examples

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Embodiment Construction

[0050] It can be understood that the content disclosed below provides many different embodiments or examples to realize different features in each embodiment. Specific examples of components or arrangements are described below to simplify the present invention. They are, of course, illustrative only and are not intended to limit the invention. For example, in the following description, a first component formed over or on a second component may include embodiments in which the first component is formed in direct contact with the second component, and may also include an embodiment in which additional components are formed on the first component and the second component. An embodiment between the second part such that the first part and the second part are not in direct contact. Furthermore, the present invention may repeat reference numerals and / or letters in various instances. This repetition is for the purposes of simplicity and clarity and does not in itself indicate a rel...

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PUM

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Abstract

Disclosed are a wafer carrier that keeps wafers under a constant pressure, at any preset value below or above the atmospheric pressure, to prevent wafer contaminations arising from atmospheric exposure in conventional wafer carriers, and also, a wafer transport system and method utilizing the same wafer carrier. The wafer carrier charged with a preset carrier pressure is transported and docked with an airlock of a wafer processing tool comprising the airlock, a vacuum transfer module, and a process chamber. The airlock adjusts, by a gas pump, inner pressure to equate successively with, first, the carrier pressure before opening the carrier door, and next, the vacuum transfer module pressure before opening the latter's door. The wafers are then transferred into the process chamber. After processing, the wafers are transferred back into the wafer carrier and charged with the preset carrier pressure before undocked and transported to the next wafer processing tool.

Description

technical field [0001] The invention relates to the technical field of semiconductors, and more specifically, to a voltage-controlled wafer carrier and a wafer transmission system. Background technique [0002] The semiconductor integrated circuit (IC) industry has experienced exponential growth. Technological advances in IC materials and processing operations have produced generations of ICs, each generation having smaller and more complex circuits than the previous generation. [0003] ICs are formed on wafers, which must go through many process steps, each of which is typically carried out in a process chamber of wafer handling equipment specially designed for a particular process, in many cases, under vacuum or near under vacuum conditions. Typically, wafers are contained in a wafer carrier known as a Front Opening Uniform Transport Unit or Front Opening Universal Unit (FOUP) while being transported from One wafer handling tool is automatically transferred to another ...

Claims

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Application Information

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IPC IPC(8): H01L21/677H01L21/673
CPCH01L21/67126H01L21/68735H01L21/67201
Inventor 陈世宏
Owner TAIWAN SEMICON MFG CO LTD
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