Unlock instant, AI-driven research and patent intelligence for your innovation.

Fin-fet device with body contact and method of forming the fin-fet device with body contact

A body contact, fin technology, used in semiconductor devices, semiconductor/solid state device manufacturing, electrical components, etc.

Inactive Publication Date: 2017-08-29
GLOBALFOUNDRIES INC
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this approach is not compatible with a replacement metal gate (RMG) process, thus requiring that the epitaxial silicon be isolated from the contact area of ​​the multi-gate of the bulk silicon of the semiconductor substrate, and that the bulk contact also be separated from The fin is physically isolated without direct contact with the fin

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Fin-fet device with body contact and method of forming the fin-fet device with body contact
  • Fin-fet device with body contact and method of forming the fin-fet device with body contact
  • Fin-fet device with body contact and method of forming the fin-fet device with body contact

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] The following detailed description is exemplary in nature only and is not intended to limit the various embodiments, or their application and uses. Furthermore, there is no intention to be bound by any theory presented in the preceding background and the following detailed description.

[0014] Provided herein are fin field effect transistor (fin FET) devices and methods of forming the fin FET devices that enable a threshold voltage (Vt) of a transistor that can be optionally controlled by biasing Press body contact to be corrected. In particular, the FinFET device includes a body contact disposed on the fin that is identical to a transistor in electrical communication with the body contact, but maintains operability of the transistor. The methods described herein enable efficient formation of the body contact even under nano-scale size constraints by preventing direct physical contact between the body contact and the source and drain regions of the transistor. Becaus...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Fin field-effect transistor devices and methods of forming the fin field-effect transistor devices are provided herein. In an embodiment, a fin field-effect transistor device includes a semiconductor substrate that has a fin. A gate electrode structure overlies the fin. Source and drain halo and / or extension regions and epitaxially-grown source regions and drain regions are formed in the fin and are disposed adjacent to the gate electrode structure. A body contact is disposed on a contact surface of the fin, and the body contact is spaced separately from the halo and / or extension regions and the epitaxially-grown source regions and drain regions.

Description

technical field [0001] The present invention generally relates to a fin field effect transistor (fin FET) device and method of forming the same, and more particularly to a fin FET device having a body contact and forming the fin FET device having the body contact. A method for fin FET devices. Background technique [0002] Transistors, such as metal oxide semiconductor field effect transistors (MOSFETs) or just field effect transistors (FETs), are the core building blocks of most semiconductor integrated circuits (ICs). A FET contains source and drain regions between which current can flow through a channel affected by a bias voltage applied to a gate electrode over the channel. Some semiconductor ICs (eg, high performance microprocessors) can contain millions of FETs. For such ICs, reducing transistor size, and thus increasing transistor density, has long been a top priority for the semiconductor manufacturing industry. However, semiconductor performance must be maintain...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/78H01L29/06H01L21/336
CPCH01L29/66795H01L29/7851
Inventor Y·刘M·哈格罗夫C·格鲁斯费尔德
Owner GLOBALFOUNDRIES INC