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Soldering flux composition containing acrylic resin used for soldering and soldering paste composition

A technology of composition and flux, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve problems such as easy cracking, circuit short circuit, circuit metal corrosion, etc., and achieve crack suppression and separation suppression , the effect of inhibiting thermal denaturation

Active Publication Date: 2014-10-01
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when the electronic components are mounted, the flux residues remaining on the automotive substrate tend to crack due to the long-term severe temperature difference. In addition, moisture penetrates into the circuit part of the substrate through the crack and short-circuits the circuit, or make the metal of the circuit corrode such problems

Method used

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  • Soldering flux composition containing acrylic resin used for soldering and soldering paste composition
  • Soldering flux composition containing acrylic resin used for soldering and soldering paste composition
  • Soldering flux composition containing acrylic resin used for soldering and soldering paste composition

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Embodiment

[0079] The present invention will be described in detail below with reference to Examples and Comparative Examples. In addition, this invention is not limited to these Examples.

[0080] Synthesis of a compound containing a saturated alkyl group having a straight chain structure with 2 to 20 carbons

Synthetic example 1

[0082] 243.4g (3.38mol) of acrylic acid and 630.3g (2.6mol) of 2-hexyldecanol (CAS registration number: 2425-77-6) were added to a 2,000ml 4-neck flask equipped with a stirrer and a reflux condenser. OXOCOL1600, manufactured by Nissan Chemical Industry Co., Ltd.), 74.1 g (0.39 mol) of p-toluenesulfonic acid monohydrate, 4 g of p-methoxyhydroquinone, and 900 g of toluene were reacted under reflux for 6 hours. The solution was neutralized with a saturated aqueous sodium bicarbonate solution, extracted with ethyl acetate, and then concentrated to obtain 756 g of a compound (1) represented by the following general formula (7) (yield: 98%).

[0083] [chemical formula 7]

[0084] ···Formula (7)

Synthetic example 2

[0086] 756 g of a compound represented by the following general formula (8) was obtained under the same conditions as in Synthesis Example 1 except that 2-stearyl alcohol (trade name: FINE OXOCOL 180T, manufactured by Nissan Chemical Industries, Ltd.) was used as the raw material alcohol (2) (Yield: 98%).

[0087] [chemical formula 8]

[0088] ···General formula (8)

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Abstract

The invention provides a soldering flux composition containing acrylic resin used for soldering and a soldering paste composition. The soldering flux composition is provided with the good soldering performance and the good insulation performance, and can be used to prevent the adhesive performance of the soldering flux residual, and can be used to inhibit the cracks of the soldering flux residual, even under the long-term cold-heat circulation condition. The soldering flux composition is characterized in that the acrylic resin and the activator are provided; the acrylic resin can be formed by copolymerizing the monomers of the composition expressed by the formula 1; according to the formula 1, the R1 is hydrogen atom or the methyl, and the R2 and the R3 respectively expresses the saturated alkyl having 2-30 carbon numbers, and are respectively provided with the direct chain structure of the carbon chain, and no branch chain structure is provided.

Description

technical field [0001] The present invention relates to a flux composition used when soldering electronic components etc. on a printed circuit board and a solder paste composition using the same, and relates to a flux residue that is difficult to resist even in a severe environment exposed to intense cooling and heating cycles for a long period of time. A flux composition for soldering which exhibits cracks, is excellent in insulation, and can suppress the stickiness of flux residues, and a solder paste composition using the flux composition. Background technique [0002] Conventionally, in solder paste compositions used for mounting electronic components on substrates, together with solder alloy powders, a flux combination has been blended in order to remove metal oxides on the substrate and reduce the surface tension of the solder alloy powders to improve wettability. things. [0003] Furthermore, among substrates on which electronic components are mounted, for example, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363
CPCB23K35/3613B23K35/362B23K2101/42
Inventor 成濑章一郎土屋雅裕喜多村明清野桃子岛崎贵则大野耐一新井正也大年洋司
Owner TAMURA KK
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