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A manufacturing method, casing and electronic device

A manufacturing method and technology of electronic equipment, applied in the electronic field, can solve the problems of inability to diversify the color of the shell and the hard texture of the shell, and achieve the effects of good coloring effect, guaranteed color, and improved user experience

Active Publication Date: 2017-11-28
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The embodiment of the present invention provides a manufacturing method, a housing and an electronic device, which are used to solve the technical effect that the prior art cannot guarantee the hard texture of the housing of the electronic device while ensuring the color diversity of the housing of the electronic device

Method used

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  • A manufacturing method, casing and electronic device
  • A manufacturing method, casing and electronic device
  • A manufacturing method, casing and electronic device

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Embodiment Construction

[0047] The embodiments of the present invention provide a manufacturing method, a housing, and an electronic device, which are used to solve the technical effect that in the prior art, the color of the housing of the electronic device cannot be ensured while the color of the housing of the electronic device is diversified and the texture of the housing is hard.

[0048] The technical solutions in the embodiments of this application are to solve the above-mentioned technical problems, and the general idea is as follows:

[0049] A manufacturing method is provided, comprising: forming a first metal layer on a first outer surface of a substrate, wherein the substrate is specifically a metal material with a first hardness, and the content of aluminum in the first metal layer is greater than A first preset threshold, and the second hardness of the first metal layer is less than the first hardness; the first metal layer is anodized to form a second outer surface of the first metal layer ...

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Abstract

The invention discloses a manufacturing method, housing and electronic equipment. The method includes: forming a first metal layer on a first outer surface of a base material, wherein the base material is specifically a metal whose hardness is the first hardness material, the aluminum element content of the first metal layer is greater than a first preset threshold, and the second hardness of the first metal layer is less than the first hardness; anodizing the first metal layer to A first aluminum oxide layer is formed on a second outer surface of the first metal layer and a first colored layer is formed on a third outer surface of the first aluminum oxide layer. By adopting the above scheme, the technical effect of ensuring the hard texture of the housing of the electronic device while ensuring the variety of colors of the housing of the electronic device is achieved.

Description

Technical field [0001] The present invention relates to the field of electronic technology, in particular to a manufacturing method, a casing and an electronic device. Background technique [0002] With the continuous development of science and technology, electronic technology has also been developed rapidly, and there are more and more types of electronic products, and people have also enjoyed various conveniences brought about by the development of science and technology. Now people can enjoy the comfortable life brought by technological development through various types of electronic devices. [0003] In the prior art, the housing of an electronic device can usually be manufactured in the following two ways: [0004] The first one is to manufacture the housing of electronic equipment through stainless steel. The housing manufactured in this way has the technical effect of hard texture and high strength, and has good molding ability during the manufacturing process and is cheap. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C28/00
Inventor 杨文建
Owner LENOVO (BEIJING) LTD