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Large-numerical-aperture immersed projection object lens

A technology of projection objective lens and numerical aperture, which is applied in the field of projection optics, can solve problems such as material type limitations, achieve good imaging characteristics, improve lithography resolution, and reduce the difficulty of assembly and integration

Inactive Publication Date: 2014-10-22
INST OF OPTICS & ELECTRONICS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] It can be seen from the above formula that in order to obtain higher resolution, it can be achieved by shortening the wavelength of the light source or increasing the numerical aperture of the projection lithography objective lens. However, when the wavelength of the light source is shortened, the optical glass absorbs light and is used for projection. The material types of lithography objective lens will be greatly limited

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Embodiment Construction

[0033] In order to better illustrate the purpose and advantages of the present invention, the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0034] figure 1 It is a schematic diagram of the layout of the large numerical aperture immersion projection objective lens of the present invention. 26 optical elements form the transmission group G1, the transmission group G2, the transmission group G3, the reflection group, the transmission group G4, the transmission group G5, and the transmission group G6, sequentially from the beam incident direction set up.

[0035] The transmission group G1 is a unit group with a positive focal length, including the first positive lens 1, the second positive lens 2, the third positive lens 3, the fourth positive lens 4, and the first negative lens 5. The light is projected from the object plane through the transmission group After G1 converges, it enters the transmission ...

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Abstract

The invention provides a large-numerical-aperture immersed projection object lens which is used for enabling an image of an object plane to be imaged to an image plane. The large-numerical-aperture immersed projection object lens, along the optical axis direction thereof, comprises two coaxially-arranged non-spherical reflectors and six transmission groups. Sequentially arranged are, from the incidence direction of light beams, the transmission group G1 with positive focal length, the transmission group G2 with positive focal length, the transmission group G3 with positive focal length, a reflection group with negative refractive power, the transmission group G4 with negative focal length, the transmission group G5 with positive focal length, and the transmission group G6 with positive focal length. The large-numerical-aperture immersed projection object lens can reduce the image in the object plane by 0.25 times and image the reduced image to the image plane; and the projection object lens has the advantages of large numerical aperture, good imaging quality, compact structure, and easy processing and adjustment and the like.

Description

technical field [0001] The invention relates to a large numerical aperture immersion type projection objective lens used in lithography technology and semiconductor element manufacturing device, which belongs to the technical field of projection optics. Background technique [0002] Lithography is an integrated circuit manufacturing technology. It uses the principle of optical projection image to transfer the high-resolution graphics on the mask plate to the optical exposure process of the rubber-coated silicon wafer by means of exposure. Almost all integrated circuits Fabrication is done using optical projection lithography. [0003] With the continuous advancement of science and technology, various types of semiconductor chips are widely used in aerospace, military, and civilian fields such as computers. With the continuous improvement of equipment performance requirements, the resolution requirements for semiconductor chips are getting higher and higher. At present, the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B13/00G02B13/18G03F7/20
Inventor 白瑜邢廷文林妩媚朱红伟吕保斌廖志远邓超
Owner INST OF OPTICS & ELECTRONICS - CHINESE ACAD OF SCI
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