Reflective type ultra-violet lithography objective lens

Abstract

The invention provides a reflective type ultra-violet lithography objective lens. The transmitting direction of an objective plane input beam is used as a system optical axis, and a first transmission set, a reflection set and a second transmission set are placed on the system optical axis in sequence. The first transmission set has positive focal power, the reflection set has negative focal power, and the second transmission set has positive focal power. The first transmission set comprises a first positive lens, a first negative lens, a second positive lens, a third positive lens, a fourth positive lens, a second negative lens, a fifth positive lens, a sixth positive lens, a third negative lens, a seventh positive lens and an eighth positive lens, the reflection set comprises a first reflector and a second reflector, and the second transmission set comprises a ninth positive lens, a forth negative lens, a tenth positive lens, a fifth negative lens, an eleventh positive lens, a twelfth positive lens, a thirteenth positive lens, a fourteenth positive lens, a fifteenth positive lens, a sixteenth positive lens, a seventeenth positive lens, an eighteenth positive lens and a nineteenth positive lens. The reflective type ultra-violet lithography objective lens has the advantages that the numerical aperture is large, and the imagining quality is good.

Description

technical field [0001] The invention relates to a catadioptric ultraviolet lithography objective lens used in a lithography process and a semiconductor element manufacturing device, belonging to the technical field of projection optics. Background technique [0002] Lithography is an integrated circuit manufacturing technology. It uses the principle of optical projection image to transfer the high-resolution graphics on the mask plate to the optical exposure process of the rubber-coated silicon wafer by means of exposure. Almost all integrated circuits Fabrication is done using optical projection lithography. [0003] With the continuous advancement of science and technology, various types of semiconductor chips are widely used in aerospace, military, and civilian fields such as computers. With the continuous improvement of equipment performance requirements, the resolution requirements for semiconductor chips are getting higher and higher. At present, the manufacture of li...

AI Technical Summary

Problems solved by technology

[0007] It can be seen from the above formula that in order to obtain higher resolution, it can be achieved by shortening the wavelength of the light source or increasing the numerical aperture of the projection lithography objective lens. However, when the wavelength of the light source is shortened, the optical glass absorbs light and is used for projection. The material types of lithography objective lens will be greatly limited

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