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A substrate-integrated waveguide bandpass filter loaded with a five-shaped defect ground structure

A substrate integrated waveguide, defect-ground structure technology, applied to waveguide-type devices, electrical components, circuits, etc., can solve the problems of high working frequency of SIW filter, unsuitable working frequency band mobile communication system, etc., achieve light weight, easy to use Integrated, low profile effect

Active Publication Date: 2017-02-01
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem that the existing SIW filter has generally high operating frequency and is not suitable for mobile communication systems with low operating frequency bands, the present invention further proposes a substrate-integrated waveguide bandpass filter loaded with a five-shaped defect structure

Method used

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  • A substrate-integrated waveguide bandpass filter loaded with a five-shaped defect ground structure
  • A substrate-integrated waveguide bandpass filter loaded with a five-shaped defect ground structure
  • A substrate-integrated waveguide bandpass filter loaded with a five-shaped defect ground structure

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specific Embodiment approach 1

[0007] Specific implementation mode one: combine Figure 1 to Figure 5 Describe this embodiment mode. A substrate-integrated waveguide bandpass filter with a structure loaded with five-shaped defects in this embodiment mode includes a first metal printing layer 1, a dielectric substrate 2, a second metal printing layer 3 and two balanced micro The strip line 4, the first metal printing layer 1, the dielectric substrate 2, and the second metal printing layer 3 are all rectangular thin plates, and the first metal printing layer 1, the dielectric substrate 2, and the second metal printing layer 3 are arranged sequentially from top to bottom, The first metal printing layer 1 is printed on the upper surface of the dielectric substrate 2, the second metal printing layer 3 is printed on the middle part of the lower surface of the dielectric substrate 2, two balanced microstrip lines 4 are printed on the lower surface of the dielectric substrate 2, and Two balanced microstrip lines 4 ...

specific Embodiment approach 2

[0009] Specific implementation mode two: combination Figure 1 to Figure 3 To illustrate this embodiment, each balanced microstrip line 4 of a substrate-integrated waveguide broadband bandpass filter with a five-shaped defect-loaded structure in this embodiment is composed of a first rectangular segment 4-1, an isosceles trapezoidal segment 4 -2 and the second rectangular section 4-3, one end of the first rectangular section 4-1 is connected to the middle part of one end corresponding to the second metal printing layer 3, and the other end of the first rectangular section 4-1 is connected to the isosceles trapezoidal section The bottom edge of 4-2 is connected, the top edge of the isosceles trapezoidal segment 4-2 is connected to one end of the second rectangular segment 4-3, and the other end of the second rectangular segment 4-3 is connected to the end corresponding to the lower surface of the dielectric substrate 1 Central connection.

[0010] The technical effect of this ...

specific Embodiment approach 3

[0011] Specific implementation mode three: combination Figure 1 to Figure 3 Describe this embodiment mode. Each five-shaped defect ground structure 6 of a substrate-integrated waveguide bandpass filter loaded with a five-shaped defect ground structure in this embodiment consists of a long vertical slot 6-1 and a short vertical slot 6-2. Form with three horizontal grooves 6-3, three horizontal grooves 6-3 and long vertical groove 6-1 form king shape, the upper end of short vertical groove 6-2 communicates with the right end of the horizontal groove 6-3 that is positioned at the middle.

[0012] The technical effect of this embodiment is: with such arrangement, it can be ensured that the grooves of the loaded five-shaped defect ground structure can be equivalent to parallel or series inductance elements in the passband, and form a bandpass filter network together with other parameters. Other components and connections are the same as those in the first embodiment.

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Abstract

The invention relates to a substrate integrated waveguide (SIW) band-pass filter, specifically relates to an SIW band-pass filter loading fence-shaped defected ground structures, and aims to solve the problem that existing SIW filters are generally high in work frequency and are not applicable to mobile communication systems with low work frequency bands. The SIW band-pass filter comprises a first metal printing layer, a dielectric substrate, a second first metal printing layer, and two balance microstrip lines, wherein the first metal printing layer, the dielectric substrate, and the second metal printing layer are rectangular sheets and are sequentially arranged from top to bottom, the first metal printing layer is printed on the upper surface of the dielectric substrate, the second metal printing layer is printed in the middle of the lower surface of the dielectric substrate, and the two balance microstrip lines are printed on the lower surface of the dielectric substrate. The SIW band-pass filter loading the fence-shaped defected ground structures is applicable to the field of wireless communication.

Description

technical field [0001] The invention relates to a substrate-integrated waveguide band-pass filter, in particular to a substrate-integrated waveguide band-pass filter with a structure loaded with five-shaped defects, belonging to the field of wireless communication. Background technique [0002] Substrate Integrated Waveguide, also known as Substrate Integrated Waveguide (SIW), is a new waveguide structure proposed in recent years. It is a waveguide that achieves transmission characteristics similar to metal rectangular waveguides on a dielectric substrate Because of the advantages of low radiation, low insertion loss, small size, and easy integration, the structure has become a research hotspot and is also widely used in filter design. Low-cost mass production of dielectric-integrated waveguide-based filters is possible with the help of printed circuit technology. However, the bandwidth of ordinary substrate-integrated waveguide bandpass filters is generally narrow, general...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P1/20H01P1/203
Inventor 林澍罗晓赵志华刘冠君王立娜耿姝
Owner HARBIN INST OF TECH