Cooling device for semiconductor laser device

A cooling device, semiconductor technology, applied in the direction of semiconductor lasers, lasers, laser components, etc., can solve the problem of affecting the cooling of semiconductor refrigeration sheets, the inability to realize the cooling of semiconductor lasers, etc., and achieve the effect of preventing the accumulation of air bubbles

Inactive Publication Date: 2014-10-22
INST OF PHYSICS - CHINESE ACAD OF SCI
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Problems solved by technology

However, air bubbles are likely to be generated in the water path of the circulating water cooling system, and the thermal conductivity of the air bubbles is much lower than that of water. If the air bubbles gather in a part of the water path near the hot end of the semiconductor cooling chip, the heat accumulated at the hot end of the semiconductor cooling chip will not be able to be heated. Transferred to the circulating water, thus seriously affecting the cooling of the semiconductor cooling chip, and the cooling of the semiconductor laser cannot be realized

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  • Cooling device for semiconductor laser device
  • Cooling device for semiconductor laser device
  • Cooling device for semiconductor laser device

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Embodiment Construction

[0022] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with specific embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0023] This embodiment provides a cooling device for semiconductor lasers, figure 1 It shows a schematic cross-sectional view of the device, and the cooling device includes: a water-cooled base 301 made of metal aluminum with a top surface and a bottom surface, wherein the top surface is used to carry a semiconductor cooling chip 201 for cooling a semiconductor laser; the semiconductor cooling chip 201 , located on the top surface of the water-cooled base 301, and its hot end is in contact with the top surface of the water-cooled base 301; the laser base 302, located on the cold end of the semiconductor cooling plat...

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Abstract

The invention provides a cooling device for a semiconductor laser device. The cooling device comprises a water cooling base. The water cooling base is provided with a waterway for circulating cooling water. A dam structure protruded in the waterway is arranged in the waterway. The dam structure is used to divide the waterway into a first section, a second section and a third section which are communicated to each other. The first section and the third section are located on two sides of the dam structure separately. The second section is located between the first section and the third section and opposite to the dam structure. The second section is more close the one surface of the water cooling base compared with the first section and the third section.

Description

technical field [0001] The invention relates to a cooling device for a semiconductor laser, in particular to a cooling device with a water cooling passage. Background technique [0002] The single longitudinal mode laser with the D1 line wavelength of rubidium at 795nm band is the basic experimental instrument for scientific experiments such as atomic spectroscopy, quantum storage, EIT, etc. Many experiments require high power (> ~ 200mW) single longitudinal mode narrow linewidth 795nm laser. However, the commercial 795nm semiconductor laser tube output is only 50mW, which is far from meeting the needs of high-power scientific research experiments. [0003] The 808nm laser, which is similar to 795nm, is widely used for solid-state laser pumping. It is easy to buy 200mW single transverse mode 808nm semiconductor lasers and several W multi-transverse mode 808nm semiconductor lasers. Since the wavelength of the emitted laser light of a semiconductor laser is related to temp...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/024
Inventor 罗鑫宇芦小刚王如泉
Owner INST OF PHYSICS - CHINESE ACAD OF SCI
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