Radiation imaging apparatus, method of manufacturing the same, and radiation inspection apparatus
A technology of radiographic imaging and manufacturing method, which is applied in the fields of radiographic inspection devices and radiographic imaging devices, and can solve the problems of reducing the clarity of radiographic images and the like
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
no. 1 example
[0018] The following will refer to figure 2 , Figure 3A and Figure 3B The imaging device 100 according to the first embodiment is described 1 . figure 2 Schematically shows the camera device 100 1 cross-sectional structure. The scintillator substrate 120 is arranged on the sensor substrate 110 through the connection member 130 . The sensor substrate 110 can be formed by arranging a sensor array in which the sensors 111 are arranged on a substrate 112 made of glass or the like. Each sensor 111 is a photoelectric conversion element, and a CMOS sensor using crystalline silicon, a PIN sensor, or an MIS sensor using amorphous silicon can be used for the sensor 111 .
[0019] The scintillator substrate 120 includes scintillators 122 in a plurality of regions divided by members 121 . As the member 121 , for example, a light shielding member made of metal can be used, or glass, silicon, or the like can be used. For example, CsI (cesium iodide) or GOS (gadolinium sulfate) d...
no. 2 example
[0033] The following will refer to Figure 4 The imaging device 100 according to the second embodiment is described 2 . Figure 4 Schematically shows the camera device 100 2 cross-sectional structure. Camera 100 2 A substrate 123 , a reflective film 124 , and a connection member 125 are included on the upper portion of the scintillator substrate 120 . The manufacturing method according to the present embodiment differs from that of the first embodiment in that the scintillator substrate 120 is obtained by using the substrate 123 as a base and forming the member 121 for dividing the scintillator 122 on the substrate 123 .
[0034] The reflective film 124 made of metal or the like may be formed in the substrate 123 made of an organic resin such as carbon resin or the like. The reflective film 124 can be formed by, for example, deposition or sputtering. Note that the step of forming the reflective film 124 may be omitted if the substrate 123 made of, for example, white pol...
no. 3 example
[0040] The following will refer to Figure 5 , Figure 6A and Figure 6B The imaging device 100 according to the third embodiment is described 3 . Figure 5 Schematically shows the camera device 100 3 cross-sectional structure. In the first and second embodiments, the divided dimensions of the member 121 (ie, the widths of the respective regions) are equal. However, the present invention is not limited to this configuration. As exemplified in this embodiment, a configuration including divided regions having different sizes may be used.
[0041] and Figure 3A and Figure 3B similar, Figure 6A and 6B are respectively schematically showing the camera device 100 3 floor plan. In camera device 100 3 In the scintillator substrate 120, the scintillators 122 in the first regions each having a large division are formed 1 and the scintillators 122 in the second regions each having a small division 2 .
[0042] Assume that P1 is the distance between the sensors 111 in t...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More