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A technology of PCB board and conductive layer, applied in the direction of printed circuit components, etc., can solve the problems of affecting the working performance, the influence of the conductive layer of the circuit, the oxidation of the conductive layer of the circuit, etc., to achieve the guarantee of working performance, work performance and work efficiency , Guarantee the effect of working performance

Inactive Publication Date: 2014-11-12
江苏联康信息股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The conductive layer of the circuit used to lay out the circuit on the existing PCB is located on the top layer of the PCB. Due to long-term use, not only the air will oxidize the conductive layer of the circuit, but also the dust will also oxidize the conductive layer of the circuit. The electrical conductivity will affect the performance of the PCB

Method used

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Embodiment Construction

[0017] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0018] Such as figure 1 As shown, the present invention designs a PCB board, including a main circuit conductive layer 1, a first insulating layer 2 and a heat dissipation layer 3, and also includes an auxiliary circuit conductive layer 4 and a second insulating layer 5, wherein the main circuit conductive layer 1 , the first insulating layer 2, the auxiliary circuit conductive layer 4, the second insulating layer 5 and the heat dissipation layer 3 are fixed sequentially from top to bottom, the structural layout of the main circuit conductive layer 1 and the auxiliary circuit conductive layer 4 is the same, and the main circuit conductive layer 1 Each structural position corresponds to each structural position of the auxiliary circuit conductive layer 4. Each trace in the main circuit conductive layer 1 is connected to t...

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Abstract

The invention relates to a PCB which comprises a main circuit conducting layer (1), a first insulating layer (2), an auxiliary circuit conducting layer (4), a second insulating layer (5) and a radiating layer (3). The main circuit conducting layer (1), the first insulating layer (2), the auxiliary circuit conducting layer (4), the second insulating layer (5) and the radiating layer (3) are sequentially fixed from top to bottom. The main circuit conducting layer (1) and the auxiliary circuit conducting layer (4) are the same in structural configuration. The structural positions of the main circuit conducting layer (1) and the structural positions of the auxiliary circuit conducting layers (4) vertically correspond in a one-to-one mode. Routing lines in the main circuit conducting layer (1) and corresponding routing lines in the auxiliary circuit conducting layer (4) are connected at positions of nodes, and the nodes comprise external circuit connecting points and electronic element pin access points. According to the PCB, the circuit conducting layers are added on the basis of the structural layer of an existing PCB, so that the two-channel working mode of the PCB is achieved, defects in the existing PCB are effectively overcome, and working performance and efficiency of the PCB are ensured.

Description

technical field [0001] The invention relates to a PCB board. Background technique [0002] PCB board is printed circuit board, also known as printed circuit board, printed circuit board, circuit board for short, with insulating board as the base material, cut to a certain size, with at least one conductive pattern attached to it, and holes (such as component Holes, fastening holes, metallized holes, etc.), used to replace the chassis of electronic components installed in the past, and realize the interconnection between electronic components. Because this kind of board is made by electronic printing, it is called "printed" circuit board; according to the number of layers of circuit boards, it can be divided into single-sided boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer circuit boards. Since the printed circuit board is not a general terminal product, the definition of the name is slightly confusing. They are not the same, so when e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
Inventor 徐欢夏唐朝阳刘万唐红梅臧艳
Owner 江苏联康信息股份有限公司