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Machining method for determining +X direction of quartz plate

A processing method and wafer processing technology, applied in metal processing equipment, manufacturing tools, machine tools suitable for grinding the edge of workpieces, etc., can solve the problems of product qualification rate, low labor efficiency, and easy breakage.

Inactive Publication Date: 2014-11-26
LANGFANG CHINA ELECTRONICS PANDA CRYSTAL TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The currently produced MESA wafers do not carry out direction recognition, and 35%~55% of them are reversed products during VCXO processing. For example, manually carry out direction recognition selection under a microscope, because the frequency of MESA chips is usually high, and the thickness of the MESA area is very thin, which is extremely thin. It is prone to breakage, the qualified rate of the product is greatly affected, and the labor efficiency is low, which increases the labor cost

Method used

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  • Machining method for determining +X direction of quartz plate
  • Machining method for determining +X direction of quartz plate
  • Machining method for determining +X direction of quartz plate

Examples

Experimental program
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Effect test

Embodiment

[0022] 1) Design the drawing of the chamfering top, according to the size of the production crystal block, the precise position of the crystal block at the top, the length of the top groove is 15mm, the width is 2.41mm, and the depth is 5mm (taking 7050 as an example);

[0023] 2) According to the requirement that the length of the crystal lump is 22mm, the width is 2.39mm, and the height is 7mm, determine the size of the top of the chamfer (see figure 2 ), making chamfered top;

[0024] 3) Install the chamfering tip on the round machine, adjust the angle of the chamfering tip: pull out the fixing pin, and fix it in the hole of the corresponding angle (lock), a total of 8 holes, the angle between the holes is 45°;

[0025] 4) Use the chamfered tip to fix the crystal block precisely: put the crystal block into the groove of the chamfered tip;

[0026] 5) Start the stroke button to chamfer;

[0027] 6) Change the crystal lump to the required size (see Image 6 );

[0028] 7...

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Abstract

The invention relates to a machining method for determining the +X direction of a quartz plate. A chamfer centre is adopted, a quartz plate lump is placed in a chamfer centre jig before being melted, precise fixing is carried out after the chamfering angle and depth are adjusted, the quartz plate lump is utilized for carrying out chamfering, and the purpose of precisely recognizing the +X direction is achieved. The machining method is used for producing the MESA quartz plate, the MESA quartz plate is the special quartz plate specially developed to produce differential VCXOs, and the requirement of the quartz plate is to precisely recognize the +X direction of the quartz plate. By means of the machining method, the yield and work efficiency of products are greatly improved.

Description

technical field [0001] The invention relates to a control method for determining the +X direction of a chip, which belongs to the practical field of components. Background technique [0002] MESA technology refers to the technology of obtaining ultra-high fundamental frequency crystal chips through stable etching on the quartz surface. The crystal chips produced by this technology, after being made into crystal products, have better phase noise, smaller jitter values ​​and better short-term stability, etc. It has very important application value in communication and other fields. [0003] At present, in the high-frequency VCXO products of communication, 61.44MHZ and 77.76MHZ can also be obtained by grinding, 622.08MHZ is produced by SAW, and 155.52MHZ must be produced by MESA. [0004] MESA wafers require that the provided wafers can correctly identify the +X direction of the wafer before etching, because the corrosion rate of crystals in different directions is different...

Claims

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Application Information

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IPC IPC(8): H03H3/00B24B9/06G06F17/50
Inventor 杜敏董新友吴敬军赵栋梁
Owner LANGFANG CHINA ELECTRONICS PANDA CRYSTAL TECH
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