Thermally conductive silicone composition

A silicone and thermal conductivity technology, which is applied in the field of thermal conductive silicone compositions, can solve the problems of high thixotropy and poor fluidity, and achieve the effects of low thixotropy, low specific gravity and excellent thermal conductivity

Inactive Publication Date: 2014-11-26
DOW TORAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, the thermally conductive silicone compositions listed in the above-mentioned documents have high thixotropy, so there is a problem of poor fluidity

Method used

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  • Thermally conductive silicone composition

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example

[0034] The following usage examples give a detailed description of the thermally conductive silicone composition of the present invention. It should be noted that the properties cited in the examples are values ​​obtained at 25°C. In addition, the characteristics of the thermally conductive silicone composition were measured as follows.

[0035] [Hardness of silicone rubber]

[0036] A thermally conductive silicone rubber was prepared by heating the thermally conductive silicone rubber composition at 150° C. for one hour. The hardness of the silicone rubber was measured using a type A durometer in accordance with the regulations described in JIS K 6253-1997 (hardness testing method for rubber, vulcanized and thermoplastic (hardness testing method for vulcanized and thermoplastic rubber)).

[0037] [Viscosity and Thixotropy of Thermally Conductive Silicone Composition]

[0038] The viscosity of the thermally conductive silicone composition was measured using a rheometer ...

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Abstract

A thermally conductive silicone composition comprising: (A) an organopolysiloxane that is liquid at 25°C and preferably has a viscosity of from 100 to 1,000,000 mPa.s; (B) an aluminum oxide powder having an average particle size of not more than 10 mum and preferably from 1 to 8 µm; and (C) an aluminum hydroxide powder having an average particle size of greater than 10 µm and preferably not greater than 50 µm, has low thixotropy, low specific gravity, and high thermal conductivity.

Description

technical field [0001] The present invention relates to thermally conductive silicone compositions. [0002] This application claims priority from Japanese Patent Application No. 2012-054887 filed on Mar. 12, 2012, the contents of which are incorporated herein by reference. Background technique [0003] As the packing density and integration density of printed circuit boards and hybrid integrated circuits on which transistors, integrated circuits, memory elements, and other electronic parts are mounted increase, thermally conductive silicone compositions are used for effective heat dissipation. For example, as such a thermally conductive silicone composition, Japanese Unexamined Patent Application Publication No. H05-140456 describes a thermally conductive silicone rubber composition comprising: organopolysiloxane, average particle size Aluminum hydroxide powder not larger than 10 μm, alumina powder, platinum or a platinum compound, and a curing agent; Japanese Unexamined P...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/14C08K3/22
CPCC08K2003/2227C08K3/22C09K5/14C08K2201/005C08K2201/014C08G77/12C08G77/20C08K5/56C08L83/00C08L83/04
Inventor 加藤智子中吉和己
Owner DOW TORAY CO LTD
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