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Cooling apparatus for switchgear with enhanced busbar joint cooling

A technology for busbar joints and cooling devices, which is applied to cooling busbar devices, electrical switches, electrical components, etc., can solve problems such as low efficiency

Active Publication Date: 2014-11-26
ABB (SCHWEIZ) AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This heat transfer process is inefficient, and thus switching products are typically thermally limited by their rated current

Method used

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  • Cooling apparatus for switchgear with enhanced busbar joint cooling
  • Cooling apparatus for switchgear with enhanced busbar joint cooling
  • Cooling apparatus for switchgear with enhanced busbar joint cooling

Examples

Experimental program
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Embodiment Construction

[0017] refer to figure 1 , a cooling device in the form of a heat pipe system, indicated generally at 10, shown as in commonly owned, co-pending Attorney Docket No. US 11033-31-553 entitled "Switch with Evaporative Cooling Device" disclosed in the U.S. Patent Application, the contents of which are hereby incorporated by reference into this specification. The heat pipe system 10 is used to efficiently cool the main contacts 12 without compromising the safety requirements for the self-contained compartment of the switch 14 . System 10 includes an evaporator 15 associated with each main contact 12 and a heat pipe structure 16 coupled between evaporator 15 and condenser 17 . The condenser 17 is positioned at a higher level than the evaporator 15 . The heat of the main contacts 12 causes the working fluid in the evaporator 15 to evaporate and the vapor is directed to the condenser 17 . Due to the heat exchange with the surrounding air, the condenser 17 condenses the vapor back t...

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PUM

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Abstract

A cooling apparatus is provided for a switchgear having at least one primary contact to connect to a terminal of a circuit breaker, with a busbar joint connected to the primary contact. The cooling apparatus includes an evaporator associated with the primary contact. A condenser is located at a higher elevation than the evaporator. Heat pipe structure fluidly connects the evaporator with the condenser. Heat transfer structure is coupled with the busbar joint for removing heat from the busbar joint. Working fluid is in the evaporator so as to be heated to a vapor state, with the heat pipe structure transferring the vapor to the condenser and passively returning condensed working fluid back to the evaporator for cooling the at least one primary contact.

Description

technical field [0001] The present invention relates to switching circuit breakers and, more particularly, to cooling devices that enhance cooling of other hot spots along current paths. Background technique [0002] The switch configuration has a current limit based on thermal rise above ambient room temperature. It is generally desirable to limit the maximum temperature of the hottest point on the switch main bus to 105°C (a rise of 65°C over an assumed ambient temperature of 40°C), as dictated by standard IEEE 37.20.2. Typical medium and high voltage metal clad switchgear has a maximum continuous current rating of about 3000A due to heat generation. The ideal would be to increase this current rating to about 4000A. [0003] Since these switches must be resistant to arc faults, it is very difficult to dissipate the heat loss caused by the rated current inside the switch compartment. Heat losses are currently dissipated by radiation and convection from the current path t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01H9/52
CPCH01H9/52H01H2009/526H01H2009/523H02G5/10
Inventor P·考夫曼F·莫里托尔
Owner ABB (SCHWEIZ) AG
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