Capacitance type fingerprint sensor packaging structure and packaging method

A fingerprint sensor and packaging structure technology, which is applied in the field of biometric module packaging, can solve the problems of large surface area and large substrate area, and achieve the effect of reducing surface area and facilitating miniaturization

Active Publication Date: 2014-12-03
NANCHANG VIRTUAL REALITY RES INST CO LTD
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention provides a capacitive fingerprint sensor packaging structure and packaging method to solve t

Method used

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  • Capacitance type fingerprint sensor packaging structure and packaging method
  • Capacitance type fingerprint sensor packaging structure and packaging method
  • Capacitance type fingerprint sensor packaging structure and packaging method

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Example Embodiment

[0026] This embodiment provides a capacitive fingerprint sensor packaging structure. The capacitive fingerprint sensor packaging structure can be specifically provided in a fingerprint identification device. The fingerprint identification device is used to identify the user's fingerprint.

[0027] Such as Figure 1A What is shown is a schematic diagram of the capacitive fingerprint sensor packaging structure according to this embodiment. The capacitive fingerprint sensor packaging structure 200 includes an independently packaged chip 201, a fingerprint sensing element 202 and a substrate 203.

[0028] The fingerprint sensor element 202 is arranged above the chip 201 and is electrically connected to the chip 201. Specifically, the chip 201 and the fingerprint sensor element 202 can be electrically connected in a flip-chip manner; the substrate 203 is arranged under the chip 201, and the substrate 203 is electrically connected to the fingerprint sensor element. 202 is electrically co...

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Abstract

The invention provides a capacitance type fingerprint sensor packaging structure and packaging method. The capacitance type fingerprint sensor packaging structure comprises an independently packaged chip, a fingerprint sensing element and a substrate, wherein the fingerprint sensing element is arranged above the chip and electrically connected with the chip, the substrate is arranged under the chip, the substrate is electrically connected with the fingerprint sensing element through a solder ball, and the substrate is electrically connected with the chip through the solder ball and the fingerprint sensing element. According to the capacitance type fingerprint sensor packaging structure and packaging method, the fingerprint sensing element is separated from the chip and then electrically connected with the chip. Thus, the surface area of the whole fingerprint sensor packaging structure is reduced.

Description

technical field [0001] The invention relates to biometric identification module packaging technology, in particular to a capacitive fingerprint sensor packaging structure and packaging method. Background technique [0002] Fingerprint identification devices have been widely used in various terminal devices, such as mobile terminals, banking systems, attendance systems and the like. [0003] The fingerprint identification device in the prior art includes a fingerprint identification sensor chip, a control chip and a substrate, wherein, the fingerprint identification sensor chip and the control chip are fabricated on the same substrate, which obviously increases the area of ​​the substrate, thereby increasing the fingerprint identification. Identify the overall surface area of ​​the device. This is very unfavorable to the miniaturization of the terminal equipment. Contents of the invention [0004] The present invention provides a capacitive fingerprint sensor packaging st...

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Application Information

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IPC IPC(8): H01L23/31H01L23/488H01L21/56G06K9/00
CPCH01L2224/73204
Inventor 唐根初刘伟蒋芳
Owner NANCHANG VIRTUAL REALITY RES INST CO LTD
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