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A fully automatic solder paste coating machine and coating method thereof

A solder paste, fully automatic technology, used in coating, tin feeding device, welding equipment and other directions, can solve the problems of poor consistency, uneven coating, high error rate, improve quality and efficiency, uniform coating, reduce the effect of strength

Inactive Publication Date: 2016-08-17
HENAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The current solder paste coating on electronic components is mainly done manually. This method has the following disadvantages: 1. Uneven coating and poor consistency affect the soldering quality; 2. Pure manual operation, low efficiency and high error rate

Method used

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  • A fully automatic solder paste coating machine and coating method thereof
  • A fully automatic solder paste coating machine and coating method thereof
  • A fully automatic solder paste coating machine and coating method thereof

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Experimental program
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Embodiment Construction

[0030] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.

[0031] As shown in the figure, a fully automatic solder paste coating machine includes a workbench 6, a feeding device, a feeding device, a solder paste coating device, an unloading device and an electrical control device. The solder paste device and the unloading device are sequentially arranged on the workbench 6. The solder paste coating device includes an incoming material clamping mechanism for clamping the material sent by the feeding device, and a syringe for applying solder paste to the material. 28. The solder paste controller 31 connected to the syringe 28 through the air pipe and the syringe mounting frame for driving the syringe 28 to move up and down and horizontally,

[0032] Solder paste is housed in syringe 28, and described electric control device is connected with the sensor and driving device in loading device, feed...

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PUM

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Abstract

A fully automatic solder paste coating machine and coating method thereof, comprising a workbench, a feeding device, a feeding device, a solder paste coating device, a material unloading device and an electrical control device, a feeding device, a feeding device, a solder paste coating device and The unloading device is arranged on the workbench in sequence. The solder paste coating device includes a clamping mechanism for incoming materials, a syringe for applying solder paste to the material, a solder paste controller connected to the syringe through an air pipe, and a device for driving The syringe is used as a syringe mounting frame for up and down and horizontal movement. The electrical control device is connected with the sensor and drive device in the feeding device, feeding device, solder paste coating device and unloading device through electrical circuits. The electrical control device can control While the incoming material clamping mechanism drives the material to rotate, it drives the needle cylinder to move horizontally along the rotation axis of the material by controlling the syringe mounting frame. The invention can not only reduce the strength of laborers, but also has uniform coating and good consistency, and greatly improves the quality and efficiency of solder paste coating.

Description

technical field [0001] The invention relates to a machine for coating solder paste for electronic components and a coating method thereof, in particular to a fully automatic solder paste coating machine and a coating method thereof. Background technique [0002] During the production of electronic products, some components need to be coated with solder paste in a certain process to prepare for the next step of component welding or packaging. Solder paste is a new type of soldering material that emerged with the SMT (surface mount technology) surface mount technology. It is a paste formed by mixing solder powder, flux, and other surfactants and thixotropic agents. The mixture is mainly used for soldering electronic components such as PCB surface resistance, capacitor and IC in SMT industry. The current solder paste coating on electronic components is mainly done manually. This method has the following disadvantages: 1. Uneven coating and poor consistency, which affect the so...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C5/02B05C11/10B05C13/02B05D1/26B23K3/06
Inventor 张利平李立本李新忠闫海涛甄志强
Owner HENAN UNIV OF SCI & TECH
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