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Wafer, edge protection glass separation device

A technology for separating devices and wafers, applied in glass forming, glass manufacturing equipment, manufacturing tools, etc., can solve the problems of material and energy waste, reduce the quality and efficiency of wafer ingot cleaning, and occupy edge glass

Active Publication Date: 2016-10-12
JIYUAN CRYSTAL PHOTOELECTRIC FREQUENCY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to improve work efficiency, the debonding agent is directly used to melt the crystal block. At this time, since the volume and gravity of the edge glass are several hundred times that of a single wafer, the edge glass and the wafer are mixed together during the process of melting the block. It will cause damage to the chip. At the same time, since the edge protection glass occupies a large space, the combination of the two will inevitably reduce the quality and efficiency of the cleaning of the chip, resulting in waste of materials and energy.

Method used

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  • Wafer, edge protection glass separation device
  • Wafer, edge protection glass separation device
  • Wafer, edge protection glass separation device

Examples

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Effect test

Embodiment 1

[0023] Such as figure 1 , image 3 and Figure 4 Shown, a kind of wafer, edge protection glass separating device, it comprises crystal lump separation groove 2, the hydraulic cylinder 1 that is vertically arranged on the outside of described crystal lump separation groove 2 and the motor that drives described hydraulic cylinder 1, and described crystal lump The lump separation tank 2 is filled with a chemical solvent, such as a dewaxing agent, etc., which can separate the crystal lump, separate the wafer from the edge glass, and simultaneously separate the wafer from the wafer, so as to realize the melting of the crystal lump.

[0024] The telescoping rod of the hydraulic cylinder 1 is provided with a lifting frame 3, and the lifting frame 3 is provided with a separation connecting rod 4, and the bottom of the separation connecting rod 4 is provided with a material rack 41, and the material rack 41 is arranged on Above the crystal lump separation tank 2; the telescopic rod o...

Embodiment 2

[0032] The difference between this embodiment and Embodiment 1 is that a cleaning device is added. The specific structure is as figure 2 , image 3 and Figure 4 , a wafer, edge protection glass separation device, it also includes a wafer cleaning tank 7, a vibration motor 9 installed on the lift frame 3 and a cleaning hook 8; the vibration motor 9 is arranged on the lift frame 3 On one side, the vibration motor 9 drives the cleaning hook 8 through the swing arm 91, the upper end of the cleaning hook 8 is hinged with the lifting frame 3, and the bottom of the cleaning hook 8 is provided with a cleaning material rack 81 , the cleaning material rack 81 is arranged above the wafer cleaning tank 7 . The vibration motor 9 vibrates left and right, and drives the cleaning hook 8 to swing left and right through the swing arm 91 .

[0033] A wafer cleaning cylinder is hung on the cleaning material rack 81, the structure of the wafer cleaning cylinder is the same as that of the waf...

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Abstract

The invention provides a device for separating wafers and edge protection glass, which includes a crystal lump separation tank, a hydraulic cylinder vertically arranged outside the crystal lump separation tank, and a motor for driving the hydraulic cylinder; the expansion and contraction of the hydraulic cylinder The rod is provided with a lifting frame, and the lifting frame is provided with a separation hook rod, and the bottom of the separation hitch rod is provided with a material rack, and the material rack is arranged above the crystal lump separation groove; the material rack A wafer collection cylinder and a crystal lump placement cylinder set in the wafer collection cylinder are installed on the top. The cylinder wall of the wafer collection cylinder is densely covered with overflow holes. The crystal lump placement cylinder includes a cylinder wall and a plurality of parallel A round rod arranged at the bottom of the cylinder wall. The chip and edge protection glass separation device has the advantages of scientific design, reasonable structure, fast separation, good cleaning effect and high production efficiency.

Description

technical field [0001] The invention relates to a separation device, in particular to a separation device for wafers and edge protection glass. Background technique [0002] The processing of SMD wafers includes ingot orientation, ingot cutting, large-scale grinding, sticking, cutting, grinding, ingot cleaning, corrosion and other links. Due to the thin thickness and small size of a single wafer, the thinnest one is only 30 microns thick, and the size is about 1.6*1.1mm. A single wafer is easy to cause problems such as cracks and fragments during processing. In order to facilitate large-scale production and avoid damage to the wafer, the wafer must be bonded with sticky wax after grinding, and multiple wafers are bonded together to form a crystal block and edge protection glass is glued around the crystal block, and then the The crystal ingot is processed by cutting, grinding, etc., and after reaching the size required by the process, the ingot is transformed. [0003] Whe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03B20/00
Inventor 王修新申红卫郑许生赵峰董振峰
Owner JIYUAN CRYSTAL PHOTOELECTRIC FREQUENCY TECH CO LTD