Photocurable thermosetting composition, method for producing cured product thereof, cured product, and printed circuit board having same
A heat-curable and light-curable technology, applied in printed circuit, printed circuit manufacturing, printed circuit secondary treatment, etc., can solve problems such as difficult to obtain high-definition patterns, achieve excellent storage stability, excellent durability, Excellent manufacturing efficiency and durability
Active Publication Date: 2017-09-22
TAIYO HLDG CO LTD
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
On the other hand, the screen printing method uses a stencil for the above-mentioned pattern formation and transfers ink with a squeegee, but it is difficult to obtain a high-definition pattern.
Method used
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Embodiment 1～8、 and comparative example 1～9
[0115] I. Modulation of Composition
[0116] Each component was mixed in the ratio shown in Table 1, and this was stirred with the dissolver. Regarding Examples 7 and 8, dispersion was further performed with a bead mill, followed by filtration with a 1 μm disc filter. Thus, the composition of this invention and a comparative composition were obtained.
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Abstract
The present invention provides a photocurable thermosetting composition, which has a viscosity corresponding to that suitable for an inkjet printer, can directly draw a pattern on a substrate for a printed circuit board, and can be cured at a relatively low temperature. After curing, it has Excellent adhesion, chemical resistance, heat resistance, and insulation. The present invention provides a photocurable thermosetting composition characterized by containing a (meth)acryloyl group-containing monomer, a blocked isocyanate, and a photopolymerization initiator, and is suitable for printing by an inkjet method.
Description
technical field [0001] The present invention relates to a photo / thermosetting composition, and particularly relates to a photo / thermosetting composition that can be suitably used for printing by an inkjet method. [0002] Furthermore, this invention relates to the manufacturing method of the hardened|cured material obtained using the said photo / heat-curable composition, a hardened|cured material, and the printed wiring board which has a hardened|cured material. Background technique [0003] Conventionally, a photographic development method and a screen printing method have been used to form a resist film, a solder resist film, and a mark of a printed circuit board. [0004] In the photographic development method, a photosensitive resin material and a photomask are applied on a substrate, and exposed to light so that only the part of the photosensitive resin material not covered by the photomask is photocured, and the uncured part is dissolved by a developer solution, thereby...
Claims
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IPC IPC(8): C09D11/30B41M5/00C08F2/44H05K3/28
CPCB41M7/009C08F2/48C09D11/101C09D11/322C08F222/102C08F222/103H05K3/287H05K2203/013Y10T428/24802Y10T428/24917B41J2/00C08F220/18C08F222/1006C08G18/62C09D11/107G03C1/498C09D11/30
Inventor 崔城豪志村优之依田健志宇敷滋
Owner TAIYO HLDG CO LTD
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