Method and system for removing colloids

Abstract

The invention discloses a method and system for removing colloid. The method includes: first controlling a staining part pivotally connected to a device body to rotate around its own axis. Then, a workpiece, such as a touch device component, a display device component, etc., with an adhesive attached to one surface thereof, is moved relative to the adhesion part so that the adhesion part contacts the adhesive, and the adhesive is affected by the adhesive. The removing pulling force exerted by the staining part in a direction away from the surface of the workpiece causes the adhesive roll to be attached to the staining part. Finally, the workpiece is moved relative to the staining part within the adhesive adhesion range, so that the adhesive is rolled away from the workpiece by the staining piece, thereby obtaining a clean finished product. In addition, the present invention also provides a system for removing colloids. The invention can efficiently remove adhesive and avoid damage to the workpiece during the adhesive removal process.

Description

technical field [0001] The present invention relates to a method and system for removing glue, in particular to a method and system for removing glue used in touch device components and display device components. Background technique [0002] In touch devices (such as capacitive sensing devices, resistive signal sensing devices, etc.) and display devices (such as liquid crystal displays, light-emitting diode displays, etc.) in current electronic products, an adhesive is often used to bond the two phases of the device. neighboring elements. However, during the bonding process, due to factors such as inaccurate alignment of the two components, bubbles in the glue, and glue overflow, it is necessary to remove the glue that has adhered to the two components, and then re-bond The two elements. [0003] Specifically, when two components are rebonded, it is necessary to carry out two steps of (1) destroying the colloidal structure adhered between the two components so that the tw...

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Problems solved by technology

[0005] However, for step (2), the existing methods are not yet mature and effective. For example, U.S. Patent Publication No. 20110126989 discloses a technical means of manually rolling the glue on a component to separate the glue from the component. However, the efficiency of this method is very low, and the positive pressure applied to the component due to manual rolling is easy to damage the component; another example is the US Patent Publication No. 20130034713, which discloses the technology of using a cylindrical rod to remove the glue on a component , but the positive pressure on the component when using the cylindrical rod to remove the glue is also prone to damage the component due to compression

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