Method and system for removing colloids

A colloid and viscose technology, applied in metal processing and other directions, can solve the problems of component damage, immature and effective, easy to damage components, etc.

Inactive Publication Date: 2017-01-11
DAXIN MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, for step (2), the existing methods are not yet mature and effective. For example, U.S. Patent Publication No. 20110126989 discloses a technical means of manually rolling the glue on a component to separate the glue from the component. However, the efficiency of this method is very low, and the positive pressure applied to the component due to manual rolling is easy to damage the component; another example is the US Patent Publication No. 20130034713, which discloses the technology of using a cylindrical rod to remove the glue on a component , but the positive pressure on the component when using the cylindrical rod to remove the glue is also prone to damage the component due to compression

Method used

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  • Method and system for removing colloids
  • Method and system for removing colloids
  • Method and system for removing colloids

Examples

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Embodiment Construction

[0037] refer to figure 1 , figure 2 , a preferred embodiment of the method for removing colloids of the present invention is as figure 2 The degumming system 1 shown is performed.

[0038] The glue removing system 1 includes a work piece 11, a glue removing device 12, and a control interface (not shown). The work object 11 includes a surface 111, and an adhesive 112 attached to the surface 111 of the work object 11. In the adhesive removal system 1 implemented in this preferred embodiment, the work object 11 is, for example, a capacitor in a touch device. Touch panels, resistive touch panels, optical touch panels and other components, or components such as liquid crystal display panels, light-emitting diode display panels, plasma display panels, and electronic paper in display devices.

[0039] The adhesive removing device 12 includes a device body 121 , and a sticking member 122 pivotally connected to the device body 121 and capable of being controlled to rotate around a...

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PUM

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Abstract

The present invention discloses a method and a system for removing gel. The method comprises steps of controlling a gel pasting attachment pivoted to the device body to rotate around the axis; allowing an operating element with gel pasted, such as a touch control device element or a display device element to move relative to the gel pasting attachment to allow the gel pasting attachment to contact the gel, allowing the gel to be coiled and attached to the gel pasting attachment through a pulling force in the direction far from the surface of the operating element and applied on the gel pasting attachment; and moving the operating element to move relative to the gel pasting attachment in the scope of the gel pasting attachment, allowing the gel to be coiled to be departed from the operating element to obtain a clean finished product. Furthermore, the present invention also provides a system for removing gel. The method and the system can efficiently remove the gel, and prevent damage to the operating element in the gel removal process.

Description

technical field [0001] The present invention relates to a method and system for removing glue, in particular to a method and system for removing glue used in touch device components and display device components. Background technique [0002] In touch devices (such as capacitive sensing devices, resistive signal sensing devices, etc.) and display devices (such as liquid crystal displays, light-emitting diode displays, etc.) in current electronic products, an adhesive is often used to bond the two phases of the device. neighboring elements. However, during the bonding process, due to factors such as inaccurate alignment of the two components, bubbles in the glue, and glue overflow, it is necessary to remove the glue that has adhered to the two components, and then re-bond The two elements. [0003] Specifically, when two components are rebonded, it is necessary to carry out two steps of (1) destroying the colloidal structure adhered between the two components so that the tw...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B26D3/28
Inventor 林典庆徐志贤李宛谕林佑忠
Owner DAXIN MATERIALS
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