A kind of aluminum-silicon alloy of rheological die-casting heat dissipation shell and its preparation method

A technology of aluminum-silicon alloy and heat-dissipating shell, which is applied in the field of aluminum-silicon alloy and its preparation, can solve the problems of heat dissipation performance deviation, high thermal conductivity, and large volume of the heat-dissipating shell, so as to ensure uniformity, meet fluidity requirements, The effect of efficient preparation

Active Publication Date: 2016-10-26
ZHUHAI RUNXINGTAI ELECTRICAL +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the heat dissipation shell of wireless communication equipment is mainly produced by high-speed die-casting (die-casting for short). its heavy weight
The commonly used materials for heat dissipation shells are Japanese standard ADC12, national standard YL102 or European standard AlSi10Mg. The high thermal conductivity is 121W / (m.K), and the lower one is only 92W / (m.K). Therefore, the existing heat dissipation shells are generally In terms of heat dissipation performance deviation, larger heat dissipation teeth are required to meet the heat dissipation requirements, so the volume is larger

Method used

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  • A kind of aluminum-silicon alloy of rheological die-casting heat dissipation shell and its preparation method
  • A kind of aluminum-silicon alloy of rheological die-casting heat dissipation shell and its preparation method
  • A kind of aluminum-silicon alloy of rheological die-casting heat dissipation shell and its preparation method

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Effect test

Embodiment 1

[0028] The technical solution adopted in the present invention is an aluminum-silicon alloy of rheological die-casting heat dissipation housing, the mass percentage of each component in the aluminum-silicon alloy is: silicon 8.0%, copper 1.5%, zinc 2.0%, nickel 2.0%, magnesium 0.8% , iron 1.0%, the rest is aluminum and unavoidable trace impurities.

Embodiment 2

[0030] An aluminum-silicon alloy for a rheological die-casting heat dissipation shell, the mass percentage of each component in the aluminum-silicon alloy is: 5.5% silicon, 0.1% copper, 0.1% zinc, 0.1% nickel, 0.1% magnesium, 0.1% iron, and the rest Aluminum and unavoidable trace impurities.

Embodiment 3

[0032] An aluminum-silicon alloy of a rheological die-casting heat dissipation shell, the mass percentage of each component in the aluminum-silicon alloy is: 6.5% silicon, 0.8% copper, 0.9% zinc, 0.8% nickel, 0.4% magnesium, 0.5% iron, and the rest Aluminum and unavoidable trace impurities.

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Abstract

The invention discloses an aluminum-silicon alloy for a rheological die-casting heat dissipation housing. The mass percentages of each component in the aluminum-silicon alloy are: 5.5-8.0% of silicon, 0.1-1.5% of copper, 0.1-2.0% of zinc, and 0.1-2.0% of nickel. 2.0%, magnesium 0.1-0.8%, iron 0.1-1.0%, the rest is aluminum and unavoidable trace impurities. The invention also discloses a method for preparing the aluminum-silicon alloy of the rheological die-casting heat dissipation housing. The rod head is used to send the solid No. 1 metal into the liquid No. 2 metal solution. Under the action of air blowing and stirring, the The slurry in the spoon is efficiently mixed evenly. The aluminum-silicon alloy of the present invention has the advantages of high thermal conductivity, good liquid fluidity, and is suitable for semi-solid rheological die-casting of heat dissipation shells. The preparation method is simple and easy to operate, so that the aluminum-silicon alloy has higher uniformity and fluidity, and is convenient Prepare the rheological die-casting heat sink.

Description

technical field [0001] The invention relates to one, in particular to an aluminum-silicon alloy of a rheological die-casting heat dissipation housing and a preparation method thereof. Background technique [0002] Communication equipment, especially wireless communication base stations, consume more and more power, which brings many difficulties to installation and transportation. Weight and volume have become one of its important competitiveness elements. Light weight, miniaturization, and high heat dissipation performance are its development trends. [0003] At present, the heat dissipation shell of wireless communication equipment is mainly produced by high-speed die-casting (die-casting for short). It is heavy. The commonly used materials for heat dissipation shells are Japanese standard ADC12, national standard YL102 or European standard AlSi10Mg. The high thermal conductivity is 121W / (m.K), and the lower one is only 92W / (m.K). Therefore, the existing heat dissipatio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C21/02C22C1/02C22C1/10B22D17/00
Inventor 任怀德刘金饶龙谨景佰亨李谷南王继成
Owner ZHUHAI RUNXINGTAI ELECTRICAL
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