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Composite material for thermal management and preparation method of composite material

A composite material and heat management technology, applied in the field of thermal management composite materials and its preparation, can solve problems such as poor thermal conductivity, thermal expansion coefficient matching of integrated circuit chips does not meet the requirements, etc., and achieve good thermal conductivity

Active Publication Date: 2019-12-13
NAT CENT FOR ADVANCED PACKAGING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, the technical problem to be solved by the present invention is to overcome defects such as poor thermal conductivity of thermal management materials related to graphene in the prior art and unsatisfactory matching of thermal expansion coefficients with integrated circuit chips, thereby providing a thermal Managed composite materials and methods for their preparation

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  • Composite material for thermal management and preparation method of composite material
  • Composite material for thermal management and preparation method of composite material
  • Composite material for thermal management and preparation method of composite material

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Embodiment 1

[0049] This embodiment provides a composite material for thermal management and a preparation method thereof, which specifically includes the following steps:

[0050] Preparation of graphene film: disperse graphene oxide powder in deionized water, ultrasonically disperse, and make 1.0g / L graphene oxide dispersion liquid, prepare by vacuum filtration method to obtain length 50mm, width 30mm and thickness A 200μm graphene film is formed under a pressure of 1 bar, and then reduced with HI solution to obtain a graphene film;

[0051] Helical structure graphene: Curling the graphene film forms a cylindrical graphene film roll with a diameter of 1 mm, and makes the cross-section of the graphene film spiral. Cutting the graphene film roll makes its height 0.3mm, for subsequent use;

[0052] The cladding method is used to prepare composite materials for thermal management: WCu10 with a length, width and thickness of 10mm×10mm×0.5mm is used as the heat sink substrate 1, and copper fo...

Embodiment 2

[0054] This embodiment provides a composite material for thermal management and a preparation method thereof, which specifically includes the following steps:

[0055] Preparation of graphene film: disperse graphene oxide powder in deionized water, ultrasonically disperse, and prepare a 0.1g / L graphene oxide dispersion, and prepare it with a length of 100 mm, a width of 100 mm and a thickness of 100 mm by vacuum filtration. It is a graphene film of 200 μm, the film forming pressure is 0.5 bar, and then the graphene film is obtained after reduction with sodium borohydride solution;

[0056] Helical structure graphene: Curling the graphene film forms a cylindrical graphene film roll with a diameter of 5mm, and makes the cross section of the graphene film spiral. Cutting the graphene film roll makes its height 0.5mm, for subsequent use;

[0057] The cladding method is used to prepare composite materials for thermal management: 50mm×50mm×0.5mm MoCu30 is used as the heat sink subs...

Embodiment 3

[0059] This embodiment provides a composite material for thermal management and a preparation method thereof, which specifically includes the following steps:

[0060] Preparation of graphene film: using chemical vapor deposition method, a single-layer graphene film is grown on the surface of copper to obtain a copper-graphene film with a length of 100 mm, a width of 50 mm and a thickness of 30 μm;

[0061] Helical structure graphene: Curling the graphene film forms a cylindrical copper-graphene film roll with a diameter of 3 mm, and makes the cross-section of the copper-graphene film spiral. Cutting described copper-graphene film roll makes its height be 0.5mm, standby;

[0062] Composite materials for thermal management prepared by cladding method: 50mm×50mm×0.5mm WCu20 is used as the heat sink substrate, and 50mm×50mm×0.03mm aluminum foil (first metal layer 2), 50mm×50mm×0.03mm aluminum foil (first metal layer 2), 50mm× 50mm×0.03mm copper-graphene film (first heat transfer...

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Abstract

The invention belongs to the technical field of graphene preparation, and particularly relates to a composite material for thermal management and a preparation method of the composite material. The composite material comprises two metal layers which are arranged at an interval, and a first heat transfer layer and a second heat transfer layer which are arranged between the two metal layers, and heat transfer interfaces of the first heat transfer layer and the second heat transfer layer are perpendicular to each other. The composite material is a thermal management material integrating the horizontal direction and the vertical direction, is an efficient thermal management structure vertically located between a heat source and a heat sink, and has better thermal conductivity and thermal expansion coefficient matching performance with an integrated circuit chip.

Description

technical field [0001] The invention belongs to the technical field of graphene preparation, and in particular relates to a composite material for thermal management and a preparation method thereof. Background technique [0002] With the increasing integration scale of electronic circuits, the calorific value per unit area increases correspondingly when integrated circuits work, resulting in a significant increase in the failure probability of packaging systems. In order to improve the packaging reliability of integrated circuits, there is an urgent need for new thermal management materials with high thermal conductivity and matching the expansion coefficient of integrated circuit chips. [0003] Graphene is the thinnest two-dimensional material found so far. It is a carbonaceous material formed by densely packing a single layer of carbon atoms. It has a very high in-plane thermal conductivity, and its thermal conductivity can reach 5000W / m K Carbon nanotubes and diamonds,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/14
CPCC09K5/14
Inventor 曹立强丁飞
Owner NAT CENT FOR ADVANCED PACKAGING
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