Probe card and its manufacturing method

Abstract

The present invention provides a probe card corresponding to two measurement temperatures and a manufacturing method thereof. The probe card connects the electrodes of the test object to the tester in order to conduct an electrical test on the test object placed on the workbench with the heat source installed. The probe card includes: a circuit substrate formed with a conductive path connected to the tester; a probe substrate formed with a conductive path corresponding to the above-mentioned conductive path of the circuit substrate and provided with a probe connected to the conductive path; The thermal expansion adjustment member is combined with the probe base and has a linear expansion coefficient different from that of the probe base in order to limit thermal expansion and contraction of the probe base, and the thermal expansion adjustment member and the probe base form a complex. It is set as follows: if the composite body is at the corresponding attainment temperature when the specimen is at the two measurement temperatures, then the temperature difference between each measurement temperature and the corresponding attainment temperature is set. The amount of expansion and contraction of the body is roughly equal.

Description

technical field [0001] The present invention relates to a probe card used in an electrical test of an object to be inspected and a manufacturing method thereof. Background technique [0002] A plurality of semiconductor integrated circuits precision-manufactured on a semiconductor wafer are usually subjected to an electrical test of whether they are manufactured in accordance with specifications before being separated into individual chips. In this electrical test, a probe assembly such as a probe card is used on which a plurality of probes (for example, a semiconductor wafer serving as an object to be inspected) connected to electrodes of respective semiconductor integrated circuits are provided. Refer to Patent Document 1). The electrodes of each semiconductor integrated circuit of the semiconductor wafer are connected to the tester via the probe card by connecting with the corresponding probes of the probe card. [0003] More specifically, such a test is performed at a ...

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Problems solved by technology

[0011] However, in this case, since it is necessary to arrange a heat source for keeping the temperature uniform over the entire area of ​​the probe substrate also on the probe substrate provided with the wiring circuit, the structure of the probe substrate cannot be avoided.

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