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A preparation method of three-dimensional integrated inductor structure

An integrated inductance and three-dimensional technology, applied in the direction of inductors, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of increasing the inductance value and failing to increase the magnetic flux of the inductance

Active Publication Date: 2017-02-08
WUHAN XINXIN SEMICON MFG CO LTD
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Problems solved by technology

[0005] In view of the above problems, the present invention provides a method for preparing a three-dimensionally integrated inductance structure to solve the defects that the inductive magnetic flux cannot be increased to increase the inductance value while reducing the eddy current and improving the quality factor Q value

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  • A preparation method of three-dimensional integrated inductor structure
  • A preparation method of three-dimensional integrated inductor structure
  • A preparation method of three-dimensional integrated inductor structure

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Embodiment Construction

[0033] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

[0034] In order to increase the magnetic flux of the inductor to increase the inductance value while reducing the eddy current, and improve the quality factor Q value and the performance of the inductor coil, it is necessary to prepare a three-dimensional integrated inductor structure, including: a metal frame, in the area surrounded by the metal frame There are a number of side-by-side chip cores, and the two ends of each core are fixed on the opposite sides of the metal frame; in addition, it also includes an inductance coil, which is in a three-dimensional spiral shape and surrounds the metal frame in multiple turns in one direction. on all cores in the area.

[0035] The present invention will be described in detail below in conjunction with specific drawings.

[0036] Such as Figure 1~8b...

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Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to a method for preparing a three-dimensional integrated inductance structure, which can realize the inductance of the three-dimensional structure, and form a single-direction detour around the magnetic core by preparing the top metal wire and the bottom metal wire interconnection The three-dimensional spiral inductance coil can greatly increase the inductance magnetic flux to increase the inductance value while reducing the eddy current, and improve the quality factor Q value and the performance of the inductance coil.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for preparing a three-dimensionally integrated inductor structure. Background technique [0002] With the advancement of science and technology and the improvement of social informatization, more and more technical fields such as computers and communications use radio frequency technology, which promotes the rapid development of radio frequency technology (RFIC). For high frequency, small power consumption, low The requirements of distorted radio frequency technology make the inductance coil necessary. The inductance coil is wound on the lead frame by wires, and the wires are insulated from each other. The winding can be hollow or contain an iron core, referred to as inductance. The inductance is mainly used It is used to isolate and filter AC signals or form a resonant circuit with capacitors and resistors. The most important indicator for evaluatin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/71
CPCH01L28/10
Inventor 梅绍宁鞠韶复朱继锋
Owner WUHAN XINXIN SEMICON MFG CO LTD
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