Air bridge integrated inductor and manufacturing method thereof

Abstract

The invention discloses an air bridge integrated inductor and a manufacturing method thereof. The manufacturing method comprises the steps of manufacturing a first inductive metal layer on a substrate; manufacturing a first layer of photoresist on the first inductive metal layer, and etching the bridge pier position of the air bridge to be manufactured to form a groove; manufacturing a metal connecting layer on the first layer of photoresist and the groove; manufacturing a second layer of photoresist on the metal connecting layer; exposing and developing on the second layer of photoresist, and removing the metal connecting layer on the groove to form an air bridge path; manufacturing a second inductive metal layer on the second layer of photoresist, wherein the second inductive metal layer is connected with the first inductive metal layer at the position of the groove; and removing the first layer of photoresist, the metal connecting layer and the second layer of photoresist. The air bridge integrated inductor takes the second inductive metal layer as main metal to enable an inductance coil to be distributed in a three-dimensional mode, thereby improving the inductive magnetic flux to increase the inductance and reducing the eddy current at the same time, and improving the quality factor Q value and the performance of the inductance coil.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for manufacturing an air bridge integrated inductor and the integrated inductor. Background technique [0002] In the prior art, most integrated inductors with a planar structure are used. Since this integrated inductor is fabricated on a plane parallel to the substrate, under high-frequency conditions, an eddy current (Eddy Current) will be formed in the substrate, and the eddy current The direction is opposite to the direction of the current in the inductor coil, which will lead to a decrease in the magnetic flux of the inductor coil, a large additional energy loss and a decrease in the Q value of the entire inductor. In addition, in the prior art, due to the limitations of the manufacturing process and materials of the integrated circuit, it is difficult for the integrated inductor to simultaneously achieve a high inductance value and a high qualit...

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Problems solved by technology

[0002] In the prior art, most integrated inductors with a planar structure are used. Since this integrated inductor is fabricated on a plane parallel to the substrate, under high-frequency conditions, an eddy current (Eddy Current) will be formed in the substrate, and the eddy current The direction is opposite to the direction of the current in the inductor coil, which will lead to a reduction in the magnetic flux of the inductor coil, a large additional energy loss and a decrease in the Q value of the entire inductor

In addition, in the prior art, due to the limitation of integrated circuit manufacturing process and materials, it is difficult to achieve high inductance value and high quality factor Q value at the same time.

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