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A laser drilling alignment method

A technology of laser drilling and alignment, applied in printed circuits, electrical components, and electrical connection formation of printed components, etc. The effect of drilling deviation and improving precision

Active Publication Date: 2017-05-17
NEW FOUNDER HLDG DEV LLC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The invention provides a laser drilling alignment method, so as to avoid laser drilling deviation, laser drilling hole breakage, individual short / open circuit problem

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  • A laser drilling alignment method
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Embodiment Construction

[0031] In order to enable those skilled in the art to better understand the technical solution of the present invention, the laser drilling alignment method provided by the embodiment of the present invention will be described below with reference to the accompanying drawings.

[0032] The laser drilling alignment method provided by the embodiment of the present invention can be used for making blind holes or buried holes in multilayer circuit boards. In the embodiment of the present invention, the blind via or the buried via is used as an example for connection between two circuit layers. Among them, the inner board and the outer board are the inner board and the outer board relative to the currently processed blind hole or buried hole, that is, the outer side of the currently processed blind hole or buried hole (that is, the side away from the central substrate) ) The circuit board where one end is located is the outer layer board, and the circuit board where the other end o...

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Abstract

The invention discloses a laser drilling alignment method. The method comprises the steps that alignment points are arranged on an inner-layer plate; the alignment points arranged on the inner-layer plate are exposed after an outer-layer plate is subjected to press fitting; laser blind holes or buried holes are drilled with the alignment points as benchmarks. By the adoption of the laser drilling alignment method, the precision of the blind holes or the buried holes drilled through lasers can be improved, and the problems of laser drilling deviation, laser drilled hole breakout, hole shortness / breakage, low circuit board production efficiency and low yield caused by poor precision of laser drilled locating holes can be solved.

Description

technical field [0001] The invention relates to the technical field of multilayer printed circuit boards, in particular to a laser drilling alignment method. Background technique [0002] With the development of PCB boards towards miniaturization and high density, more and more boards use buried blind holes to achieve high-density interconnection. Laser drilling is one of the methods to realize tiny blind holes. Fierce market competition also puts forward higher and higher requirements for the reliability of boards. For blind holes, achieving high reliability requires a large area of ​​good connections. Therefore, in the process of making blind holes, laser drilling Good alignment accuracy is a key. [0003] At present, there are mainly two alignment methods of laser drilling. One method is: firstly, laser drilling positioning holes are drilled by laser drilling, then, the laser drilling machine searches for the laser drilling positioning holes, and finally, the laser blin...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/40
Inventor 叶万全何永清
Owner NEW FOUNDER HLDG DEV LLC