A grid type gas distribution device for mocvd reactor
A gas distribution device and gas distribution technology, applied in gaseous chemical plating, metal material coating process, coating and other directions, can solve the problems of excessive deposits, strong pre-reaction, etc., to extend the cleaning cycle, reduce waste, Reduced effect of deposition reactants
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[0042] figure 1 Shown is a schematic diagram of a currently widely used MOCVD reaction chamber 1 . The first precursor gas, the second precursor gas, and the carrier gas enter the reaction chamber 3 surrounded by the reaction chamber wall 10 through the connecting pipe 8 located above an embodiment of the present invention (gas distribution device 2), and the reactant source material After entering the reaction chamber through the gas distribution device 2, it reaches the wafer 4 placed on the upper surface of the loading tray through processes such as diffusion and transportation. The wafer 4 rises to the process temperature under the action of the heating device 7 located under the loading tray, and reacts The source material is deposited on the surface of the wafer 4 through a series of complex physical and chemical reactions to obtain the required film material, and the reaction waste is discharged out of the reaction chamber through the tail gas outlet 9 . Generally, dur...
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