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Printed board copper plating concentrated solution formula

A technology for concentrated liquid and printed board, which is applied in the field of printed board manufacturing, can solve the problems of accelerated working liquid aging, affecting the performance of concentrated liquid, high cost consumption, etc., and achieves the effect of improving stability

Inactive Publication Date: 2015-01-07
WUXI CHANGHUI ELECTROMECHANICAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing copper plating concentrate contains copper sulfate, which is not easy to control the concentration. When the acidity is too high, the performance of the concentrate will be affected, and the cost will be greatly consumed, which will accelerate the aging of the working solution.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] First take 800mL of deionized water into the container, then mix 350g / L potassium sodium tartrate with 50g / L sodium chloride solution, stir evenly, then add 280g / L copper chloride and 50g / L phosphate, Stir evenly. At this time, a little flocculent precipitate will appear in the solution, and then continue to add 100g / L potassium sodium tartrate and 200g / L sodium chloride. At this time, the precipitate disappears, and the configuration is completed.

[0012] During use, copper chloride and phosphate can be added according to the consumption of copper ions to ensure that the content of copper ions is within a certain range. Make the solution stable.

[0013] The invention is easy to operate and easy to use, uses copper chloride to be configured as neutral or weakly acidic to store divalent copper ions, and improves storage stability.

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PUM

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Abstract

The invention discloses a printed board copper plating concentrated solution formula. The formula is characterized by comprising the following constituents according to weight ratio: 280 g / L of copper chloride, 60 g / L of phosphate, 450 g / L of potassium sodium tartrate, 250 g / L of sodium chloride, 12 ml / L of formaldehyde. The printed board copper plating concentrated solution formula is high in stability and easy to prepare.

Description

technical field [0001] The invention relates to a method for manufacturing a printed board, in particular to a formula of a concentrated solution for copper plating of a printed board. Background technique [0002] At present, a process of electrically interconnecting the conductive patterns of each layer of the printed board is mainly realized by hole metallization technology. The most widely used process is electroless copper for hole metallization. For printed board processing, it is deposited on the activated printed board substrate and hole wall surface. In order to achieve high-quality, efficient, fast, accurate operation and quality control, most of the electroless copper plating solutions are stored, transported, opened and supplemented in the form of concentrated solutions. The existing copper plating concentrate contains copper sulfate, which is not easy to control the concentration. When the acidity is too high, the performance of the concentrate will be affecte...

Claims

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Application Information

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IPC IPC(8): C23C18/40
CPCC23C18/405
Inventor 杨彦涛
Owner WUXI CHANGHUI ELECTROMECHANICAL TECH