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Film forming method

A film forming method and film thickness technology, applied in ion implantation plating, coating, instruments, etc., can solve the problems of decreased adhesion of the antifouling layer, shortened processing time, and waste of processing time, achieving manufacturing cost reduction, Realize the effect of reducing manufacturing cost and removing process

Active Publication Date: 2016-03-30
ULVAC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] In addition, when performing a constant temperature and constant humidity treatment in which the formed antifouling layer (organic layer) is kept in a constant temperature and constant humidity atmosphere, it is relatively easy to maintain the film properties, but since it takes time for the treatment, there is a need to shorten the treatment time. Require
[0011] However, even in this case, care must be taken not to reduce the adhesion between the antifouling layer and its underlying layer due to the state of use

Method used

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Examples

Experimental program
Comparison scheme
Effect test

experiment example 1

[0166] With the film forming apparatus according to Embodiment 1, after vapor deposition was performed so that the film thickness of the vapor deposition film serving as the antifouling layer 4 was 5 nm, the laminated structure 1 was formed without performing the finishing process. In addition, the conditions which are not described are the conditions corresponding to those described in Embodiment 1.

experiment example 2

[0168] As the finishing process, the temperature: 40° C., humidity: 80%, and time: 2 hours in a constant temperature and humidity furnace were used to form a laminated structure under the same conditions as in Experimental Example 1 except this point.

experiment example 3

[0170] As a finishing process, the temperature in a constant temperature and humidity furnace: 40°C, humidity: 80%, and time: 2 hours are performed, and then, as a removal process, the surface of the laminated structure 1 is wiped, except for this point. The laminated structure 1 was formed under the same conditions as in Experimental Example 1.

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Abstract

A film formation method for forming an organic layer configured from a fluorine-containing resin on a substrate, the film formation method having a vapor deposition film forming step for forming the organic layer as a vapor-deposited film, a film thickness measuring step for measuring the film thickness of the vapor-deposited film, and a determination step for determining a parameter for feedback so as to correct a condition in the vapor deposition film forming step on the basis of the result of measuring the film thickness.

Description

technical field [0001] The present invention relates to a film forming method. [0002] This application claims priority based on Japanese Patent Application No. 2012-185443 for which it applied in Japan on August 24, 2012, and uses the content here. Background technique [0003] Currently, in various terminals such as portable terminals, a touch panel in which the human body directly touches the panel surface and operates is often used. Since the human body directly touches the surface of the panel, the surface of the touch panel is prone to scratches and dirt, so an antifouling layer (organic layer) is provided. [0004] Fluorine-based resins are often used as antifouling layers. As a method of forming a film made of a fluororesin, a vacuum vapor deposition method is known (for example, Patent Document 1). [0005] Patent Document 1: Japanese Patent Laid-Open No. 2010-106344 [0006] According to Patent Document 1, a film excellent in film quality can be efficiently fo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/54C23C14/12G06F3/041B05D7/24
CPCC23C14/12C23C14/547
Inventor 吉田隆松本昌弘谷典明池田进久保昌司
Owner ULVAC INC
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