Circuit board for integrated back light module and manufacturing method of circuit board

Abstract

The invention relates to a circuit board for an integrated back light module and a manufacturing method of the circuit board. The circuit board is characterized in that the circuit board is enabled to be provided with a first surface and a second surface opposite to the first surface; an electronic device circuit is arranged on the first surface of the circuit board; a surface light source module is arranged on the second surface and comprises a reflecting metal layer, a plurality of light emitting diodes (LED) and light guide material layers, wherein the reflecting metal layer is positioned on the second surface of the circuit board; the LEDs are arranged on the second surface of the circuit board in a surface adhering mode; each light guide material layer covers the corresponding LED. The circuit board for the integrated back light module can be applied to all electronic devices having the demand of back light; the casing thicknesses of the electronic devices can be reduced and the manufacturing cost of the electronic devices can be reduced.

Description

technical field [0001] The invention relates to a circuit board integrating a backlight module and a manufacturing method thereof, in particular to a related technology of directly integrating a backlight module on a circuit board. Background technique [0002] Liquid crystal display is still the most popular flat-panel display at present. One of the characteristics of liquid crystal display is that it does not emit light itself. The light source on the screen comes from the internal backlight module. The existing backlight modules can be roughly divided into side-type and Direct-lit backlight modules, so-called edge-lit backlight modules such as Figure 6 As shown, a cold cathode lamp (CCFL) 71 is provided at one end of the light guide plate 70 in the longitudinal direction, and a reflector 72 is provided on the inner side of the light guide plate 70, and the outside of the light guide plate 70 is sequentially arranged from the inside to the outside There is a lower diffusi...

AI Technical Summary

Problems solved by technology

For example, when used in smart phones or tablet computers, the most obvious problem is that the thickness of these devices cannot be effectively reduced. The reason is that the aforementioned backlight module has a light guide plate of considerable thickness and a multi-layer structure. With a considerable thickness, when used in the aforementioned smartphones or tablet computers, there are inherent restrictions on its thickness

[0006] Furthermore, the above-mentioned backlight module uses a limited light source to provide a side light source through light guide and diffusion, so the brightness is also limited.

On the other hand, traditional backlight modules use reflective sheets and a large number of optical films, so there is also the problem of high manufacturing costs

[0007] From the above, it can be seen that when the existing backlight modules are used in electronic devices such as smart phones and tablet computers that require as thin and light as possible, the thickness of these electronic devices is limited. Therefore, it is necessary to further review and seek a feasible solution.

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