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Flip chip semiconductor encapsulation structure

A packaging structure and flip-chip technology, which is applied to semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve the problems of semiconductor device failure, weak coupling, poor contact between semiconductor chips and lead frames, etc., to achieve Reliable electrical connection, increased mechanical strength, and the effect of preventing solder from flowing away from the interconnection position

Active Publication Date: 2015-01-14
NANTONG FUJITSU MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Due to the defects of the forming method, it will inevitably cause a series of defects in the package structure itself, such as poor contact between the semiconductor chip and the lead frame, weak coupling, etc.
These will lead to the failure of semiconductor devices

Method used

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  • Flip chip semiconductor encapsulation structure
  • Flip chip semiconductor encapsulation structure
  • Flip chip semiconductor encapsulation structure

Examples

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Embodiment Construction

[0029] In order to make the above objects, features and advantages of the present invention more comprehensible, the specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0030] In the following description, specific details are set forth in order to provide a thorough understanding of the invention. However, the present invention can be implemented in many other ways than those described here, and those skilled in the art can make similar extensions without departing from the connotation of the present invention. Accordingly, the invention is not limited to the specific implementations disclosed below.

[0031] In view of the above defects, the present invention provides a flip-chip semiconductor packaging structure.

[0032] refer to figure 1 , the first embodiment of the present invention provides a flip-chip semiconductor packaging structure, including:

[0033] A semiconductor...

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Abstract

The invention discloses a flip chip semiconductor encapsulation structure which comprises a semiconductor chip, multiple copper posts, a lead frame, an insulating layer on the surface of the lead frame, multiple solder interconnection structures and moulding complexing agents. The surface of the semiconductor chip is provided with a pad pattern, and the copper posts are formed on the pad pattern. The insulating layer is provided with an opening, the area of the opening is larger than the cross area of each copper post, and leads on the upper portion of the lead frame are exposed at the opening. The solder interconnection structures are located between the copper posts and the leads exposed at the opening, and the moulding complexing agents are used for encapsulating the assembly. The flip chip semiconductor encapsulation structure enables the semiconductor chip to be firmly coupled on the lead frame, and meanwhile bad contact between the semiconductor chip and the lead frame is prevented.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a flip-chip semiconductor packaging structure. Background technique [0002] Over time, semiconductor packaging structures are becoming smaller and more concentrated and manufactured in a variety of shapes. Semiconductor package structures are typically classified into a wire bonding type or a flip chip bonding type according to a connection method. The wire bonding type packaging structure uses conductive bonding wires to connect the electrodes of the semiconductor chip to the lead frame, while the flip chip type packaging structure uses conductive bumps placed on the electrode pads of the semiconductor chip. Connecting terminals to connect semiconductors to leads or to connect semiconductor chips directly to circuit boards. The package structure of the flip-chip bonding type has a shorter electrical connection path than the package structure of the metal bonding type, ...

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L23/495
CPCH01L2224/16245
Inventor 石磊
Owner NANTONG FUJITSU MICROELECTRONICS
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