Structure and packaging technology method of camera module
A camera module and packaging process technology, applied in the directions of installation, image communication, color TV components, etc., can solve the problems that the packaging process is difficult to meet the reliability test requirements, product performance degradation, reliability performance degradation and other problems, Achieve the effect of improving reliability performance, enhancing competitiveness, and increasing structural stability
Inactive Publication Date: 2015-01-21
JIANGXI SHENGTAI OPTICS CO LTD
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Problems solved by technology
[0003] With the thinning and lightening of electronic products, the development direction of the thinning and lightening of the camera module is mainly flip-chip (FC) and chip-on-board (COB). When the package becomes thinner and thinner, its reliability performance will be reduced. , if it is difficult to meet the reliability test requirements with the conventional packaging process, then the performance of the product will also decline, so the packaging process is very important
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[0009] see figure 1 , the specific embodiment adopts the following technical solutions: it includes a reinforcing sheet 1, a CMOS image sensor chip 2, a flexible circuit board 3, a mirror holder 4, a metal wire 5, a resistance element 6, an adhesive 7, a filter glass 8, The lens barrel 9 and the lens 10, the upper end of the reinforcing sheet 1 is provided with a flexible circuit board 3, and the flexible circuit board 3 on one side extends to the reinforcing sheet 1, and a CMOS image sensor chip 2 is arranged in the middle of the upper end of the outer reinforcing sheet 1, and Both sides of the CMOS image sensor chip 2 are connected to the flexible circuit board 3 through several metal wires 5, the right side of the CMOS image sensor chip 2 and the upper surface of the flexible circuit board 3 are provided with a resistance element 6, and the CMOS image sensor Adhesive 7 is arranged around the sensor chip 2, the adhesive 7 is connected with the reinforcement sheet 1 and the f...
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The invention relates to the technical field of electronic products, in particular to a structure and packaging technology method of a camera module. A flexible circuit board is arranged at the upper end of a bracing sheet, a CMOS image sensor chip is arranged in the middle of the upper end of the outer bracing sheet, adhesives are arranged around the CMOS image sensor chip, the adhesives are connected with the bracing sheet and the flexible circuit board, a lens seat is arranged on the upper surface of the flexible circuit board, a lens cone is rotatably connected in the upper side of the lens seat, a plurality of lenses are arranged in the lens cone, and filter glass is arranged at the lower ends of the lenses and on the inner side of the lens seat. The image sensor chip is directly and fixedly pasted on the bracing sheet, a circuit board layer between the image sensor chip and the bracing sheet is omitted, meanwhile, the space among the chip, the circuit board and the bracing sheet is filled with the abrasives, the module is more stable in constitutive property, and the reliability performance of the module is improved.
Description
Technical field: [0001] The invention relates to the technical field of electronic products, in particular to a camera module structure and packaging process method. Background technique: [0002] Camera modules are widely used in consumer digital products, such as mobile phones, tablet computers, notebook computers, toys, vehicles, and medical care. With the development of the information age and the advancement of technology, camera modules have entered thousands of households. Especially with the advent of the mobile Internet era, smartphone shipments are still increasing significantly, especially the advent of the 4G era, which will further drive the rapid rise in demand for camera modules. [0003] With the thinning and lightening of electronic products, the development direction of the thinning and lightening of the camera module is mainly flip-chip (FC) and chip-on-board (COB). When the package becomes thinner and thinner, its reliability performance will be reduced. ...
Claims
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IPC IPC(8): H04N5/225G02B7/02
Inventor 邓明育赵伟谭青华黄欢赵赟
Owner JIANGXI SHENGTAI OPTICS CO LTD