Feeding system and feeding method for silicon chip quality sorting equipment

A silicon wafer and sorting technology, which is applied in the field of feeding systems, can solve the problems of labor-intensive, low yield of silicon wafers, etc., and achieve the effects of fast feeding speed, high reliability and simple control.

Active Publication Date: 2015-01-28
48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Abstract
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AI Technical Summary

Problems solved by technology

Traditional silicon wafer quality sorting equipment basically adopts the method of lamination and feeding, which requires manual removal of silicon wafers from the basket box, which inevitably leads to damage such as hidden cracks, edge chipping, missing corners, and dirt on silicon wafers. It consumes a lot of labor and reduces the yield of silicon wafers

Method used

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  • Feeding system and feeding method for silicon chip quality sorting equipment
  • Feeding system and feeding method for silicon chip quality sorting equipment
  • Feeding system and feeding method for silicon chip quality sorting equipment

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Embodiment Construction

[0033] Attached below Figure 1-5 The present invention is further introduced, but not as a limitation to the present invention.

[0034] A feeding system suitable for silicon wafer quality sorting equipment, such as Figure 1-3 As shown, it includes lifting motor 1, high-precision vertical ball screw 2, loading box 3, flower basket box 4, silicon wafer 5, sliding door 6, loading sensor 7, sheet detection sensor 8, stop sensor 9, and transmission motor 10 , Conveyor belt 11, switching motor 12, high-precision horizontal ball screw 13. The lifting motor 1 is divided into two left and right ones, which respectively drive the corresponding high-precision ball screw 2 to move in the vertical direction. The high-precision vertical ball screw 2 is divided into two left and right parts, which are connected to the corresponding feeding box 9 in the vertical direction to realize the lifting operation of the feeding box. The feeding box 3 is divided into 2 left and right, and each lo...

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Abstract

The invention discloses a feeding system for silicon chip quality sorting equipment. The feeding system mainly comprises multiple feeding units with the same structure. Each one of the feeding units comprises a vertical guide rail, the vertical guide rail is provided with a feeding box, a basket case is installed in the feeding box, a side of the vertical guide rail is provided with a horizontal transmission mechanism, the horizontal transmission mechanism is used for transmitting silicon chips in the basket case to a downstream station, an output end of the horizontal transmission mechanism is provided with a horizontal guide rail, and the multiple horizontal transmission mechanisms can horizontally move reciprocatingly so that butt joint of the corresponding horizontal transmission mechanism and the downstream station is switched and thus when the feeding box in the multiple feeding units carries out feeding, the rest of the feeding boxes carry out loading. The multiple feeding units are installed on the horizontal guide rail capable of horizontally moving so that left-to-right switching of the multiple feeding units is realized. When one of the feeding units carries out a feeding process, the rest of the feeding units carry out basket case loading so that uninterrupted feeding is realized.

Description

technical field [0001] The invention relates to a feeding system and a feeding method suitable for silicon chip quality sorting equipment, belonging to the field of solar photovoltaic equipment. Background technique [0002] Silicon wafer quality sorting equipment is a device that integrates feeding, testing and sorting to detect the appearance, resistivity, hidden cracks, minority lifetime and black core of silicon wafers. The silicon wafer factory cuts silicon ingots into silicon wafers and loads them in flower baskets for cleaning. After cleaning, the flower baskets can be directly loaded into this loading device for quality sorting of silicon wafers. [0003] Silicon ingots need to be cleaned after being cut into silicon wafers. The current cleaning equipment mainly includes two types, one is to load flower baskets for cleaning, and the other is to automatically load silicon wafers into flower baskets after cleaning. The cleaned silicon wafers need to be inspected and c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B07C5/02
Inventor 尹昊陈勇平郭立王娟龙辉
Owner 48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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