Chip testing equipment with high universality

Abstract

The invention provides chip testing equipment with high universality. The chip testing equipment with high universality comprises a chip connector, a chip press-fit device and a chip testing equipment body, and is characterized by further comprising a testing adapter plate. Lower surface contact points matched with testing connecting points are arranged on one surface of the testing adapter plate, upper surface contact points which are consistent with external pins of a chip to be tested in distribution are arranged on the other surface of the testing adapter plate, and the lower surface contact points are connected with the upper surface contact points. The chip electric performance testing equipment can effectively test the chip, when coordinates and the number of the external pins of the chip to be tested change due to the changes of the encapsulated type and the encapsulated size of the chip and the number of the pins, just the corresponding testing adapter plate needs to be replaced, and therefore the product universality of a testing machine is improved, a great amount of time and capital investment needed by modification of the testing machine for each kind of product are avoided, and chips can be tested rapidly.

Description

technical field [0001] The present invention relates to a chip testing device with high versatility, and more specifically, to a chip testing device with high versatility, which realizes the transfer of external pins of the chip through a test adapter board. Background technique [0002] With the vigorous development of the semiconductor industry, there are large differences in chip types, pin numbers, distribution, package types, and package sizes. After the chip is packaged, electrical performance testing is required to screen chips with good functions. [0003] Generally speaking, in the known chip test technology, the structure of common test equipment is as follows figure 1 As shown, in view of different chip package types, different package sizes, different numbers of external pins, and differences in the coordinates of the external pins, it is necessary to specially design and process the matching test component chip connector 1 to realize the electrical performance ...

AI Technical Summary

Problems solved by technology

However, in this structure, on the one hand, a large amount of capital investment is required to modify the separate test equipment to make it suitable for chips of a specific size, a specific number of external pins, and a specific package type, that is, for tests of different sizes, the versatility is poor; on the other hand , It takes a long time to modify the test equipment for different chips, and it takes a long time to put it on the market. It is not suitable for large investme

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