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Polygon packaging structure

A technology of polygonal structure and packaging structure, applied in the directions of packaging, transportation and packaging, packaging of vulnerable items, etc., can solve the problems of increasing the operation steps of the staff, the large size of the large packaging box, and the difficulty of the staff to operate, etc., to improve the space utilization. efficiency, reducing packaging costs, and the effect of low packaging costs

Inactive Publication Date: 2015-02-04
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the packaging box has good compressive strength and impact resistance, the number of container panels is usually less, generally less than 10; when increasing the number of container panels, it is necessary to add support parts inside the box to improve the box quality. The compressive strength of the body increases the operating steps of the staff, which is not conducive to improving work efficiency and increasing packaging costs
[0009] (3) The large packing box is bulky, and it is not easy to take out the assembled panel
The panels near the edge of the large packing box are easier to take out, while the panels located in the center are far away from the staff, making it difficult for the staff to operate and take out the assembled panels.

Method used

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Embodiment Construction

[0036] In order to better illustrate the technical characteristics and structure of the present invention, the following is a detailed description in conjunction with preferred embodiments of the present invention and accompanying drawings.

[0037] refer to image 3 , the polygonal packaging structure provided by the present invention is used for packaging sheet carriers, at least comprising a buffer base 230 at the bottom and a buffer top cover 290 at the top, wherein the buffer base 230 includes a cushion 120 and a base 110, and the cushion 120 and the base 110 Both are polygonal structures, and the buffer pad 120 is set inside the base 110; the buffer top cover 290 includes a buffer cover 140 and a top cover 150, both of which are polygonal structures, and the buffer cover 140 is set on the top cover 150 The inside of the box body 130 is sleeved between the buffer base 230 and the buffer top cover 290, and the upper end and the lower end of the box body 130 are respectivel...

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PUM

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Abstract

The invention provides a polygon packaging structure used for packaging piece-shaped carriers. The polygon packaging structure at least comprises a buffering base arranged at the bottom and a buffering top cover arranged at the top part, wherein a plurality of containing grooves are formed in the buffering base, the containing grooves are formed in a radiating mode from the center to the periphery, and the buffering top cover is provided with fixed grooves corresponding to the containing grooves. The polygon packaging structure has the characteristics of being low in packaging cost, high in compression resistance strength, good in anti-impact performance and capable of containing many liquid crystal module boards and has the beneficial effects of being safe and reliable in packaging and convenient to operate.

Description

technical field [0001] The invention relates to a polygonal packaging structure for sheet-like objects, in particular to packaging for liquid crystal module panels. Background technique [0002] In the electronics industry, the production and assembly of electronic products requires complex supply chain support. Usually, the components of electronic products are mass-produced and manufactured in different places, and after transportation, they are uniformly delivered to the assembly factory for assembly. In the field of liquid crystal display equipment, liquid crystal modules are the core components of liquid crystal display equipment, and the reliability of packaging needs to be considered during transportation. However, because the traditional packaging method cannot bear the external pressure well during transportation, it may deform the multi-layered liquid crystal module panel, which not only affects the use effect, but also brings unnecessary losses to the enterprise....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D81/107
CPCB65D81/107B65D85/48
Inventor 赵芝霖
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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