Semiconductor refrigeration refrigerator and manufacturing method thereof

Abstract

The invention relates to a semiconductor refrigeration refrigerator and a manufacturing method of the semiconductor refrigeration refrigerator. The semiconductor refrigeration refrigerator comprises an outer shell, a semiconductor module and at least one heat end heat pipe which transmits the heat of the semiconductor module to the outer shell, and at least one part of an condensing segment of each heat end heat pipe is welded on the inner surface of the outer shell. The invention further provides the manufacturing method of the semiconductor refrigeration refrigerator. According to the semiconductor refrigeration refrigerator and the manufacturing method thereof, due to the fact that the at least one part of the condensing segment of each heat end heat pipe is welded on the inner surface of the outer shell, the surface of the outer shell can be fully used as a heat dissipation surface, a heat dissipation fan is not needed, and the semiconductor refrigeration refrigerator is energy-saving, environment-friendly, high in reliability, simple in structure, convenient to install and high in practicality.

Description

technical field [0001] The invention relates to a refrigerator, in particular to a semiconductor refrigeration refrigerator and a manufacturing method thereof. Background technique [0002] Traditional refrigerators use Freon as the refrigerant and compressors as the driving force for the internal working medium circulation of the refrigerator. There are pollution problems such as ozone layer destruction, which does not meet the national environmental protection requirements. Semiconductor refrigeration, also known as thermoelectric refrigeration, thermoelectric refrigeration. Compared with traditional vapor compression refrigeration methods, semiconductor refrigeration does not require compressors and refrigerants, and has the advantages of rapid refrigeration start-up, simple structure, and no noise. Therefore, it is considered to be an environmentally friendly refrigeration method that helps to solve the problem of ozone destruction. At the same time, semiconductor refri...

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Problems solved by technology

[0003] At present, most semiconductor refrigerators on the market use heat dissipation aluminum grooves or heat pipe fins as heat dissipation modules. Although this heat dissipation method can ensure the temperature of the cold and hot ends of the semiconductor and the air temperature in the refrigerator room, there are still some problems, such as realizing Forced convection axial flow fans need to consume extra power, and as the running time of the axial flow fans increases, the noise and failure rate generated by them will increase, which will affect the comfort of users

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