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Composite cooling components

A heat-dissipating component and composite technology, applied in the direction of cooling/ventilation/heating transformation, can solve the problems of poor adaptability of conventional water-cooled heat-dissipating devices, and achieve the effect of good heat dissipation and damage prevention

Active Publication Date: 2017-03-01
GIGA BYTE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] In view of the above problems, the present invention provides a composite heat dissipation assembly, thereby solving the problem of poor adaptability of conventional water-cooled heat dissipation devices

Method used

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  • Composite cooling components
  • Composite cooling components
  • Composite cooling components

Examples

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Embodiment Construction

[0058] Please refer to Figure 1 to Figure 2 Shown is an exploded schematic view and an assembled schematic view of the composite heat dissipation assembly and the electronic device disclosed in the first embodiment of the present invention. The composite cooling assembly of this embodiment is suitable for an electronic device 400, and this electronic device 400 has a casing 410, a circuit board 420 disposed in the casing 410, and a circuit board 420 electrically inserted into the circuit board 420. An adapter card 430 , and one side of the case 410 has an opening 411 . Wherein, the above-mentioned electronic device 400 may be a computer system mainframe or a server case, etc., and the above-mentioned circuit board 420 is similar to the electronic components configured in a conventional computer, and can also execute preset functions and application programs of the computer, etc. , so the applicant does not make further explanations here, but only elaborates on the electronic...

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Abstract

The invention relates to a composite type heat radiating assembly. The composite type heat radiating assembly is arranged on an electronic device, and the electronic device is provided with a machine casing, a circuit board and an adapter card, wherein the adapter card is electrically inserted into the circuit board. The composite type heat radiating assembly comprises a first heat radiating device and a second heat radiating device, wherein the first heat radiating device is arranged at the outside surface of the machine casing, and the second heat radiating device is arranged on the adapter card. The composite type heat radiating assembly has the advantage that when the electronic device runs, the first heat radiating device and the second heat radiating device are used for radiating the heat of the electronic device in a water cooling way, and the required heat radiating power is adjusted according to the actual heating amount of the electronic device, so the requirements of different users are met, and the economic benefits are realized.

Description

[0001] 【Technical field】 [0002] The invention relates to a heat dissipation device, in particular to a composite heat dissipation assembly composed of a plurality of heat dissipation devices. [0003] 【Background technique】 [0004] With the vigorous development of the high-tech industry in recent years, the volume of electronic components in electronic products tends to be miniaturized, and the density per unit area is also higher and higher, and the overall performance is continuously enhanced. In these factors Under the circumstances, it is also necessary to ensure that there is a heat sink with sufficient cooling capacity in a narrow area, so that the operating temperature of each electronic component in the electronic device can be kept within a reasonable range, so as to promote heat exchange between it and the environment, thereby protecting the electronic components. Components to avoid damage to electronic components or computer system crashes due to overheating. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
Inventor 毛黛娟
Owner GIGA BYTE TECH CO LTD
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