Reflow furnace monitoring system and its control method

Abstract

The present invention provides a reflow furnace monitoring system, including a first sensing device, a second sensing device, a third sensing device and a controller, the first sensing device is set at the plate inlet of the reflow furnace; the second sensing device The sensing device is arranged at the position of the zipper shaft of the reflow oven; the third sensing device is arranged at the plate outlet position of the reflow oven; the controller is respectively connected with the first sensing device, the second sensing device and the third sensing device for Collecting the signals of the first sensing device, the second sensing device and the third sensing device, and according to the comparison result between the actual overheating time of the PCB board and the calculated overheating time, or according to the actual rotation of the zipper shaft The working status of the reflow furnace can be judged by comparing the numerical value with the calculated furnace revolution value. It also relates to a control method of the reflow oven monitoring system. The reflow furnace monitoring system of the present invention is simple and convenient to install, and can accurately measure the running speed of the PCB board in the reflow furnace; the control method thereof can accurately and reliably judge the position of each PCB board flowing into the reflow furnace.

Description

technical field [0001] The invention relates to the technical field of reflow furnaces, in particular to a reflow furnace monitoring system and a control method thereof. Background technique [0002] The controller motherboard (PCB board) needs to use a reflow furnace in the SMT (Surface Mounted Technology abbreviation, surface mount technology) production process. However, due to the performance of the reflow soldering machine itself in the actual use process, it often causes PCB When the board passes through the reflow soldering machine, the board is stuck and the board is dropped. However, if the stuck and dropped boards on the PCB board cannot be detected in time, the components will be scraped off at least, and will fall into the reflow oven and be baked at worst. At present, some reflow soldering machines are stuck and dropped during the production process through the independent judgment of employees, and the timeliness of early warning for stuck and dropped boards i...

AI Technical Summary

Problems solved by technology

[0002] The controller motherboard (PCB board) needs to use a reflow furnace in the SMT (Surface Mounted Technology abbreviation, surface mount technology) production process. However, due to the performance of the reflow soldering machine itself in the actual use process, it often causes PCB The board is jammed and dropped during the process of passing through the reflow soldering machine

However, if the PCB board is stuck or dropped, if it cannot be discovered in time, the components will be scraped off at the slightest, and the components will be dropped into the reflow oven and damaged at the worst.

At present, some reflow soldering machines are stuck and dropped during the production process, all of which are judged by employees independently, and the timeliness of the early warning of stuck boards and dropped boards is not strong enough

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