Unlock instant, AI-driven research and patent intelligence for your innovation.

Circuit module

A technology for circuit modules and circuit substrates, which is applied in the directions of circuits, printed circuits, printed circuits, etc., can solve the problems of difficulty in expanding the width of grooves, insufficient filling, and narrow grooves.

Active Publication Date: 2015-02-25
KAGA FEI CO LTD
View PDF7 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Here, when filling the groove formed on the package with the conductive resin paste, the groove may be narrow and the filling may be insufficient.
If the shielding is not reliably formed in the trench, the expected shielding effect cannot be obtained
Especially in recent years, circuit modules have been miniaturized, and it has become increasingly difficult to sufficiently expand the groove width
When mounting multiple mounting parts on a small circuit board, if the groove width is enlarged, the mounting area of ​​the mounting parts will be limited

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit module
  • Circuit module
  • Circuit module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] A circuit module according to one embodiment of the present invention includes a circuit board, a mounting component, a package, and a shield.

[0035] The above-mentioned circuit board has a mounting surface.

[0036] The above-mentioned mounting member is mounted on the above-mentioned mounting surface.

[0037] The package is formed on the mounting surface to cover the mounting components, and has a groove formed from the main surface of the package toward the mounting surface, and the groove has a second groove extending from the mounting surface side. The side wall composed of the side wall part and the second side wall part on the side of the main surface has a cross-section of a plane perpendicular to the mounting surface and perpendicular to the extending direction of the groove, and the first side wall part has an opposite The first slope of the above-mentioned mounting surface is defined as the connection point between the above-mentioned first side wall port...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A circuit module includes a circuit substrate, a mount component, a sealing body, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench formed from a main surface of the sealing body to the mount surface. The trench includes side walls configured of a first side wall at a mount surface side and a second side wall at a main surface side. A straight line connecting the first point and the second point has a second slope gentler than the first slope against the mount surface. The shield covers the sealing body and has an inner shield section formed within the trench and an outer shield section disposed on the main surface and the inner shield.

Description

technical field [0001] The present invention relates to a circuit module in which mounted components are mounted and packaged on a circuit substrate. Background technique [0002] A circuit module in which a package made of synthetic resin or the like is packaged around a component mounted on a circuit board is in use. Here, when the mounted component is a wireless communication element, etc., the surface of the package is covered with a conductor and used as a shield against interference due to electromagnetic waves (hereinafter referred to as electromagnetic interference). Electromagnetic interference is, for example, interference or unnecessary radiation. By setting up shielding, it is possible to prevent electromagnetic interference to electronic equipment outside the shield caused by electromagnetic waves emitted by the installation parts in the shield (improve Emission), or prevent electromagnetic interference to installation parts in the shield caused by electromagne...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L23/552H01L25/16H05K9/00
CPCH05K1/0216H05K1/0218H05K3/107H05K3/284H05K2201/0715H05K2201/09036H05K2201/09827H05K2201/09972H01L23/3135H01L21/561H01L23/552H01L24/97H01L2224/16225H01L2224/97H01L2924/15159H01L2924/1815H01L2924/19105H01L2924/181H01L2924/12042H01L2924/00
Inventor 岛村雅哉北崎健三麦谷英儿猿渡达郎佐治哲夫中村浩
Owner KAGA FEI CO LTD