Conductive slip ring assembly assembling method

A conductive slip ring and assembly method technology, which is applied in the direction of electrical components, slip ring manufacturing, circuits, etc., can solve the problems that product reliability and pass rate cannot be effectively guaranteed, and the assembly accuracy of miniaturized products cannot be effectively controlled, so as to achieve compact structure , Strict glue filling method, small size effect

Active Publication Date: 2015-02-25
BEIJING INST OF AEROSPACE CONTROL DEVICES
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide an assembly method of a conductive slip ring assembly, which overcomes the problems in the prior art that the assembly accuracy of miniaturized products cannot be effectively controlled, and product reliability and pass rate cannot be effectively guaranteed

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  • Conductive slip ring assembly assembling method

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Embodiment Construction

[0029] The present invention comprises the following steps:

[0030] 1. After the small journal 1 is assembled and cleaned, the special two-component insulating epoxy adhesive 2 is poured to form the small journal component glue filling. After machining, the small journal assembly is formed.

[0031] 2. Weld the conductive slip ring piece 4 to lead out the wire 5 to form a slip ring assembly.

[0032] 3. First install a piece of insulating gasket 3 on the small journal assembly, and then stack the slip ring assembly and insulating gasket 3 sequentially in a way that a slip ring assembly and a piece of insulating gasket 3 form a group, and assemble 28 groups in total. Finally, after a piece of insulating spacer 3 is installed, the large journal 6 is pressed into it to form a conductive slip ring assembly blank.

[0033] 4. Vacuum infuse the conductive slip ring assembly blank with the special small conductive rod epoxy potting glue 7 (model KMT-206) to form a conductive slip ...

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Abstract

A conductive slip ring assembly assembling method includes the steps that firstly, the surface of a small shaft neck is coated with insulating epoxy adhesive, then the small shaft neck is machined, and therefore a small shaft neck assembly is formed; secondly, conductive slip ring sheets and outgoing wires are welded, so that slip ring assemblies are formed; thirdly, multiple sets of insulation spacers and the slip assemblies are installed on the small shaft neck assembly alternately at intervals; fourthly, a large shaft neck is pressed on the small shaft neck assembly, so that a conductive slip ring assembly blank is formed; fifthly, epoxy potting adhesive is injected in the conductive slip ring assembly blank in a vacuum mode, so that a conductive slip ring assembly is formed. The small shaft neck is coated with the insulating epoxy adhesive containing two components, so that the insulating effect between a shaft and the slip ring sheets is achieved, the size is small, and the structure is compact.

Description

technical field [0001] The invention relates to the field of inertial instrument components, in particular to an assembly method for small size and compact structure conductive slip ring components. Background technique [0002] The gyro accelerometer outer ring power transmission device in the inertial instrument can realize the power and signal transmission between the gyro pendulum and the outer ring. The power transmission device is composed of three parts: a conductive slip ring assembly, a brush assembly and a bracket. Among them, the assembly quality of the conductive slip ring assembly directly affects the performance of the power transmission device. Due to the volume requirements of special instruments, the conductive slip ring assembly has the characteristics of small size, compact structure and many working channels. Therefore, how to assemble a miniaturized conductive slip ring assembly that requires high precision becomes the key. [0003] The general assemb...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R43/10
CPCH01R43/10H01R39/16
Inventor 李宇梅陈小勇张福礼郑涛张学渊张佐王林李伟
Owner BEIJING INST OF AEROSPACE CONTROL DEVICES
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