Heat dissipation module

Abstract

A heat dissipation module comprises a shell, a plurality of independent shell cavities are arranged in the shell and not communicated with one another, each shell cavity is communicated with one open end of at least one heat pipe, the open ends are communicated with heat pipe cavities in the heat pipes, and the independent cavities are communicated with the heat pipe cavities.

Description

technical field [0001] The invention relates to a heat dissipation module, in particular to a heat dissipation module that dissipates heat from heat sources that generate different amounts of heat. Background technique [0002] As the current electronic equipment is gradually advertised as light and thin, the size of each component must be reduced accordingly. However, the heat generated by the size reduction of electronic equipment has become the main obstacle to improving the performance of electronic equipment and systems. Therefore, in order to effectively solve the heat dissipation problem of components in electronic equipment, the industry proposes vapor chambers and heat pipes with better heat conduction performance to effectively solve the current heat dissipation problem. [0003] The uniform temperature plate (Vapor chambef system includes a rectangular shell and the capillary structure of the inner chamber wall of the shell, and the inside of the shell is filled w...

AI Technical Summary

Problems solved by technology

[0006] Generally, the heat generated by the chip is concentrated on the surface, but the heat distribution on the surface may be inconsistent. This is due to the distribution of the integrated components in the chip. Improving the efficiency of heat conduction and effectively solving the heat dissipation problem of high-power electronic components is what the industry needs to improve at present.

Images