Fluid degassing device and method in a semiconductor processing system

A technology for processing systems and semiconductors, applied in chemical instruments and methods, semiconductor/solid-state device manufacturing, liquid degassing, etc., can solve problems such as low efficiency, affecting productivity, and poor results, achieving a high degree of automation, simple structure, The effect of stable pressure flow

Active Publication Date: 2016-03-16
上海芯源微企业发展有限公司
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, there is a problem with method 1, which is that the efficiency is low, and a separate degassing time is required, which will affect the productivity; while using method 2, because these fluids are under high pressure, many gases dissolved in the fluid cannot be degassed by this method. go, it doesn't work out

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Fluid degassing device and method in a semiconductor processing system
  • Fluid degassing device and method in a semiconductor processing system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] The present invention will be further described below in conjunction with the accompanying drawings.

[0027] like figure 1 As shown, the present invention only relates to the fluid pipeline part in the semiconductor processing system, that is, only the fluid is degassed. Etching liquid, but not limited to this, any fluid used in semiconductor processing system, the pressure range is between 0.1MPa and 0.4MPa can be degassed by this device.

[0028] A fluid degassing device in a semiconductor processing system, comprising a buffer container 6, a medium container 7, an ultrasonic transducer 14, and a transducer control unit 13, wherein the buffer container 6 is immersed in the medium of the medium container 7, and the buffer container There is a gap between the bottom surface of 6 and the bottom surface of the medium container 7; the buffer container 6 is connected to the liquid supply device 1 through the automatic valve I2, the buffer container 6 is connected to the e...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention belongs to the technical field of fluid processing in a semiconductor processing system, and concretely relates to an apparatus de-foaming a fluid in the semiconductor processing system. The apparatus comprises a buffer container, a medium container, an ultrasonic transducer, a transducer control portion and a master control portion; the buffer container is immersed in the medium of the medium container, and the ultrasonic transducer is arranged at the outer wall of the medium container, and is connected with the transducer control portion; and the transducer control portion is connected with the master control portion. A method for de-foaming the fluid is characterized in that the master control portion controls the ultrasonic transducer and all automatic valves according to feedback information of all detectors in order to de-foam the fluid in the buffer container. The apparatus and the method have the advantages of no individual time for fluid de-foaming, constant pressure in the buffer container during working, guaranteeing of the constant flow of a liquid outlet, automatic control of liquid feeding and gas discharging, high efficiency, good stability and control convenience.

Description

technical field [0001] The invention belongs to the technical field of fluid treatment in semiconductor processing systems, in particular to a fluid defoaming device for fluids with a pressure range of 0.1MPa to 0.4MPa. Background technique [0002] In semiconductor processing systems, fluids are frequently used in processes such as cleaning, coating photoresist, development, and etching. Some gases will inevitably exist in these fluids, and foam will form at the end of substrate processing. , which will lead to unstable quality of the substrate after processing. Especially during the single wafer processing process, the air bubbles formed by these terminals have a more serious impact on the quality of the product. [0003] In order to improve the product yield in these processes, removing the gas in the fluid becomes a key process point, that is, the degassing of the fluid. The commonly used defoaming methods are: [0004] 1. After filling the container with liquid, the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): B01D19/00H01L21/67
Inventor 程虎
Owner 上海芯源微企业发展有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap