Manufacturing method of yin-yang copper-thickness printed circuit board

Abstract

The invention is applicable to the technical field of processing of a printed circuit board and provides a manufacturing method of a yin-yang copper-thickness printed circuit board. Separate etching processing of a thick copper surface and a thin copper surface is adopted so as to solve a problem of incapability of processing fine lines in the prior art. The manufacturing method includes the following steps: providing a printed circuit board with different copper foil thicknesses; manufacturing conductive lines: manufacturing a first conductive line and a second conductive line on a thick copper surface and a thin copper surface respectively; and post-processing. The step of manufacturing the first conductive line on the thick copper surface includes the following steps: outer-layer pattern transference, pattern tinning and alkaline etching. The step of manufacturing the second conductive line on the thin copper surface includes the following steps: outer-layer pattern transference and alkaline etching. In the method, the first conductive pattern and the second conductive pattern are manufactured on the thick copper surface and the thin copper surface respectively so as to manufacture fine lines on the printed circuit board with different copper foil thicknesses so that the manufacturing method is suitable for processing a printed circuit board, in which the range of copper foil thicknesses of two surfaces is an any value.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board processing, and in particular relates to a method for manufacturing a yin-yang copper thick printed circuit board. Background technique [0002] In the manufacture of printed circuit boards, the etching process is an indispensable and important step. Especially with the rapid development of microelectronics technology and the wide application of large-scale integrated circuits and ultra-large-scale integrated circuits, the width and spacing of wires on printed circuit boards are getting smaller and smaller, and the wiring density and precision are getting higher and higher. Higher and stricter technical requirements are put forward for the precision and tolerance of etching, and the quality of etching directly affects the quality of printed circuit boards. [0003] For printed circuit boards with the same thickness of copper foil, usually, simultaneous etching on both sides can meet...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for manufacturing a yin-yang copper thick printed circuit board, which adopts separate etching treatment on the thick copper surface and the thin copper surface, aiming to solve the problem that the fine circuit cannot be processed in the prior art

Images